Abhi PYQ

6th Semester Syllabus

Chemical Engineering

Credits Table

Course Title L T P Credits
Heat Transfer Operation [114601] 3 0 0 3
Chemical Reaction Engineering [114602] 3 0 0 3
Simulation Software for Chemical Engineering [114603] 3 0 0 3
Employability Skills (Non-Credit) [114604] 3 0 0 0
Program Elective-I [1146XX] 3 0 0 3
Open Elective-II [1006XX] 3 0 0 3
Heat Transfer Operation Lab [114601P] 0 0 2 1
Chemical Reaction Engineering Lab [114602P] 0 0 2 1
Simulation Software for Chemical Engineering Lab [114603P] 0 0 2 1
NPTEL Courses-I Lab [114605] 0 0 4 2
TOTAL 20

Theory Subjects

Lab Subjects

Heat Transfer Operation [114601]

  • Unit 1.0: Conduction
    • Basics concept of heat transfer
    • Steady state & unsteady state heat transfer
    • Concept of driving force & Fourier's law of heat transfer
    • Modes of heat transfer
    • Conduction
    • Convention & radiation
    • Concept of thermal conductivity
    • Calculation of thermal conductivity for solid
    • Liquid & gases
    • Rate of heat transfer from plane wall
    • Composite wall
    • Sphere & cylinder
    • Concept of thermal diffusivity
    • Lagging of pipes
    • Concept & importance of insulation
    • Critical thickness of insulation
    • Unsteady state conduction: Biot number
    • Fourier number
    • Numerical based on above topics
  • Unit 2.0: Convection
    • Concept of convection mode of heat transfer
    • Concept of heat transfer coefficient
    • Derivation for individual & overall heat transfer coefficient
    • Natural convection: Introduction convection current
    • Coefficient of thermal expansion
    • Significance of dimensionless number
    • Dimensionless analysis
    • Forced convection: Introduction
    • Thermal & hydrodynamic boundary layer
    • Heat transfer in laminar & turbulent flow inside & outside tube
    • Heat transfer analogies
    • Reynold's analogy
    • Prandtl analogy
    • Concept of condensation
    • Types & Nusselt's theory
    • Heat transfer to boiling liquids & corelations
    • Film wise & dropwise condensation on vertical & horizontal surfaces
    • Numerical on above topics
  • Unit 3.0: Radiation
    • Radiation mode of heat transfer
    • Maxwell's electromagnetic theory
    • Max Planck's theory
    • Radiative properties: Absorptivity
    • Transitivity
    • Reflectivity
    • Black body
    • Spectral black body radiation intensity
    • Gray body
    • Black body emission power
    • Wein's displacement law
    • Stephan's Boltzmann's law
    • Opaque body
    • Kirchhoff's law
    • Heat transfer between black bodies for finite & infinite distances
    • Radiation shield
    • Numerical on radiation
  • Unit 4.0: Heat Exchanger
    • Heat exchanger: Concept
    • Importance & classification
    • Calculation of overall heat transfer coefficient for heat exchanger
    • Fouling: Concept of fouling
    • Reasons of fouling
    • Methods to reduce fouling
    • Fouling factors
    • Log mean temperature: Concept of LMTD
    • Calculation of LMTD for single pass
    • Multipass
    • Parallel
    • Cocurrent & counter current flow
    • Concept of N.T.U.
    • Calculation of effectiveness for co current & counter current mode of heat transfer
    • Heat exchanger construction
    • Working
    • Merits
    • Demerits of shell & tube heat exchanger
    • Double pipe heat exchanger
    • Reboiler
    • Plate type heat exchanger
    • Fins: Concept of fins
    • Fin efficiency & effectiveness
    • Numerical based on above topics
  • Unit 5.0: Evaporators I
    • Evaporation: Concept of evaporation
    • Difference between evaporation & drying
    • Evaporator: Capacity & economy
    • Single effect & multiple effect evaporator
    • Forward feed
    • Backward feed & mixed feed to evaporator
    • Vapor recompression
    • Mass & enthalpy balance for single effect evaporator
  • Unit 6.0: Evaporators I
    • Construction
    • Working & application of evaporators such as: Falling film
    • Thin film
    • Forced circulation
    • Agitated thin film & multiple effect evaporator
    • Numerical on above topics

Text/Reference Books:

  1. Process Heat Transfer, D. Q. Kern, McGraw hill, 1997, ISBN-13: 978-0-07-463217-8; ISBN-10: 0-07-463217-5.
  2. Unit Operations of Chemical Engineering, Ma Cabe W. L., Smith J. C., Harriot P, 5th edition, McGraw Hill, 1993, ISBN: 0-07-112738-0.
  3. Chemical Engineering Design, R. K. Sinnot, Coulson & Richardsons, Vol 1 & 6, Elsevier Science & Technology Books, ISBN: 0-7506-6538-6.
  4. Heat Transfer, Holman J. P, 9th Edition, McGraw Hill, 2008., ISBN: 9780070634510, 0070634513.

Chemical Reaction Engineering [114602]

  • Unit 1.0: Kinetics of Homogeneous Reactions
    • Chemical kinetics concept
    • Parameters that influence the rate of reaction
    • Categories of reaction: Homogenous and heterogeneous reactions
    • Catalytic non-catalytic reactions
    • Molecularity of reaction
    • Exothermic and endothermic reactions
    • Order of reaction
    • Reversible and irreversible reactions
    • Elementary and non-elementary reaction
    • And chain and non-chain reaction
    • Reaction rate
    • Rate equation
    • Rate constant
    • Units of rate constant
    • Activation energy
    • Its significance and numerical
    • Temperature dependency of rate constant from: Arrhenius law
    • Transition state theory
    • And collision theory (numerical)
  • Unit 2.0: Catalysis
    • Concept of catalysis
    • Promoters
    • Inhibitors and accelerators
    • Homogeneous and heterogeneous catalytic reaction: Catalyst preparation methods: Precipitation
    • Gel formation
    • Simple mixing of components
    • Impregnation
    • Mechanism of solid gas phase catalytic reactions
    • Catalyst poisoning
    • Regeneration of catalyst
  • Unit 3.0: Batch Reactor
    • Constant volume batch reactor and variable volume batch reactor
    • Techniques of analysis of kinetic data: Integral method
    • Differential method
    • Half-life method
    • Ostwald isolation method and initial rate method
    • Constant volume batch reactor to analyse the kinetic data: Integrated rate expression for irreversible unimolecular type first order reactions and its characteristics
    • Integrated rate expression for irreversible bimolecular type second order reactions (2A→ Product) and its characteristics
    • Integrated rate expression for zero order reaction and its characteristics
    • And integrated rate expression for nth order reaction (numerical)
    • Variable volume batch reactor to analyse the kinetic data: Integrated rate expression for irreversible unimolecular type first order reaction
    • Integrated rate expression for irreversible bimolecular type second order reactions (2A → Product)
    • Integrated rate expression for zero order reaction (numerical)
  • Unit 4.0: Reactor Design
    • Reactor: Batch
    • Semi-batch
    • Continuous stirred tank reactor
    • Tubular/plug flow
    • Fixed bed fluidised bed reactor (diagram, brief description and applications)
    • Define of space time
    • Space velocity
    • Holding time for flow reactors (numerical)
    • Performance/design equation at constant and variable volume system with their graphical representation (numerical) for the following: Ideal batch reactor
    • Continuous stirrer tank reactor (CSTR) (numerical)
    • Plug flow reactor (PFR) (numerical)
  • Unit 5.0: Size Comparison of Plug Flow Reactor (PFR) and Continuous Stirrer Tank Reactor (CSTR)
    • Size comparison of single reactor: CSTR and PFR
  • Unit 6.0: Multiple Reactor System
    • Equal and unequal size CSTR in series
    • Judgement of the best system for given conversion in PFR and CSTR connected in series
    • CSTR connected in parallel
    • PFR connected in series or in parallel
    • PFR connected in series parallel combination

Text/Reference Books:

  1. Chemical Reaction Engineering, Octave Levenspiel, Wiley India, New Delhi, 2015 ISBN-978-81-265 1000-9.
  2. Chemical Engineering Kinetics, J. M. Smith, Mc-Graw Hill New Delhi, 2015 ISBN 007*066574-5.
  3. Elements of Chemical Reaction Engineering, H. Scott Fogler, Pearson New Delhi, 2015 ISBN 978-81-317-1430-0.
  4. A textbook of Engineering Chemistry, S. S. Dara, S, Chand and Company Limited, New Delhi ISBN-10. 8121903599

Simulation Software for Chemical Engineering [114603]

  • Unit 1.0: Introduction to Software in Chemical Engineering
    • Importance of software tools in chemical engineering
    • Categories of software: Simulation
    • Design
    • Data analysis
    • And control
    • Overview of commonly used software: ASPEN Plus
    • HYSYS
    • CHEMCAD
    • MATLAB
    • ANSYS Fluent
    • COMSOL Multiphysics
  • Unit 2.0: Process Simulation & Modelling
    • Introduction to process simulation: Importance of simulation in chemical engineering
    • Types of process models: Steady-state modelling
    • Dynamic modelling
    • Software tools for process simulation: ASPEN Plus
    • HYSYS
    • CHEMCAD
    • DWSIM
    • Process flow diagram (PFD) development
    • Thermodynamic property models
    • Multicomponent distillation
    • Reactors
    • And heat exchangers
    • Sensitivity analysis and process optimization
    • Economic evaluation and cost estimation
  • Unit 3.0: Computational Fluid Dynamics (CFD) in Chemical Engineering
    • Introduction to CFD: Governing equations of fluid flow operation
    • Heat transfer operation
    • Mass transfer operation
    • Navier-Stokes equations
    • Turbulence modeling
    • Software tools for CFD simulations: ANSYS Fluent
    • Open FOAM
    • Solving single-phase and multiphase flow problems
    • Heat exchanger and reactor simulations
    • COMSOL Multiphysics
    • Modelling chemical reactions
    • Heat transfer
    • And fluid dynamics
    • Industrial application of computational fluid dynamics
  • Unit 4.0: Data Analysis & Optimization
    • Introduction to data analytics in chemical engineering: Big data applications in chemical process industries
    • Statistical tools for process analysis
    • Regression analysis for process optimization
    • Software tools for data analysis & optimization: MATLAB & Python (NumPy, Pandas, SciPy)
    • Process data visualization and machine learning applications
    • Nonlinear regression for reaction kinetics
    • GAMS (General Algebraic Modelling System) for process optimization
  • Unit 5.0: AI Tools in Chemical Engineering
    • Introduction to AI & machine learning for chemical processes
    • AI vs. traditional process modelling
    • Types of machine learning
    • AI-based process optimization & fault detection
    • Neural networks (ANNs) for chemical process modelling
    • Applications in predictive maintenance and quality control
  • Unit 6.0: Software Tools for AI in Chemical Engineering
    • Python (TensorFlow, Scikit-Learn, PyTorch): AI-based chemical process modelling
    • MATLAB AI Toolbox: AI-assisted predictive maintenance in chemical engineering

Text/Reference Books:

  1. Unit Operations of Chemical Engineering, Warren L. Mccabe, Julian C. Smith, Peter Harriott, McGraw Hill International Edition. ISBN: 0-07-112738-0.
  2. Chemical Engineering, Vol. 1 and 2, Coulson J. M., Richardson J. F., Backhurst J. R. and J. H. Harker, Butterworth Heinemann, ISBN: 0-7506-4445-1.
  3. Chemical Engineering Process Simulation, Dominic Foo, Elsevier, ISBN-10: 0323901689 ISBN-13: 978-0323901680.
  4. Chemical Thermodynamics for Process Simulation, Jürgen Gmehling, Michael Kleiber, Bärbel Kolbe, Jürgen Rarey, Wiley, ISBN: 978-3-527-34325-6.
  5. Chemical Process Design and Simulation: Aspen Plus and Aspen Hysys Applications, Juma Haydary, Wiley, ISBN:9781119089117.
  6. Introduction to Chemical Engineering Computing, Bruce A. Finlayson, Wiley, ISBN-13: 978-0-471-74062-9 ISBN-10: 0-471-74062-4
  7. An Introduction to Computational Fluid Dynamics: The Finite Volume Method, H. K. Versteeg, Pearson Education, ISBN: 978-0-13-127498-3
  8. Numerical Methods for Engineers, Steven C., Chapra, Raymond P. Canale, McGraw-Hill Higher Education, ISBN-10007339792X, ISBN-13: 978-0073397924
  9. GAMS A User's Guide, GAMS Development Corporation, GAMS Development Corporation
  10. Artificial Intelligence in Chemical Engineering, Thomas E. Quantrille, Yih An Liu, Academic Press, ISBN-13: 978-0080571218
  11. MATLAB for Machine Learning, Giuseppe Ciaburro, Packt Publishing, ISBN-10: 1788398432, ISBN-13: 978-1788398435

Employability Skills (Non-Credit) [114604]

  • Unit 1.0: Goal Setting
    • Career planning
    • SWOT
    • Resume using internet formats
    • Showcase portfolios
  • Unit 2.0: Goal Setting-II
    • Personal grooming
    • Self-introduction
    • Website development
  • Unit 3.0: Capacity Development I
    • Interview skills
    • Group discussion - Do's & don'ts
    • Leadership
    • Teamwork
    • How to interrupt
    • Synthesis
    • And analysis of topics
  • Unit 4.0: Capacity Development II
    • Social media for personal enrichment
    • Body language
    • Self-management
    • Emotional intelligence
  • Unit 5.0: Utilising Potential I
    • Social networking
    • Social engagements
    • Volunteering
    • Collaboration & team-work
  • Unit 6.0: Utilising Potential II
    • QC-tools - Check sheets
    • Fishbone diagram
    • Histogram
    • Pareto chart
    • Control-chart
    • Scatter diagram
    • Stratification
    • Lean manufacturing
    • Kanban
    • Kaizen
    • Five S
    • Poka-yoke
    • Quality circle

Text/Reference Books:

  1. Employability Skills Skills for Employability, Dr. M. Sen Gupta, Innovation Publication Pvt Ltd, 2020 ISBN: 978-81-933819-1-5.
  2. Employability Skills, Dr. Nishith Rajaram Dubey, Anupam Singh, Indra Publishing House, 2023 ISBN 978-93-93577-68-9
  3. Organizational Behavior, A. K. Chitale, Rajendra Prasad Mohanty and Dr Nishith Dubey, PHI Learning Pvt Ltd ISBN 978-81-203-4696-3.
  4. Managerial Skills, Dr Nishith Dubey & Prof Gitanjali Shrivastava, Shiva Prakashan, Indore, India, 2010, ISBN 81-7677-100-7.
  5. Body Language, Allan Pease, Pease International PTY. Ltd Australia.
  6. Production and Operations Management Goods & Services approach, Dr S.V Deshmukh, Dr A. K. Chitale and Dr Nishith Dubey, Archers & Elevators publishing house, Bangalore, ISBN 9789386501197
  7. Emotional Intelligence, Daniel Goleman, Word Press. Com, 9789382563792
  8. How to win friends and influence people, Dale Carnegie, Srishti Publishers & Distributors, Delhi, India

Program Elective-I: Plant Utility and Maintenance [114606]

  • Unit 1.0: Industrial Water I
    • Industrial water: Properties
    • Uses
    • Hard & soft water
    • Hardness: Total hardness
    • Permanent hardness
    • Temporary hardness
    • Units of hardness
    • Alkalinity
    • Numerical
    • Boiler feed water
    • Scale and sludge formation
    • Corrosion
    • Priming and foaming
    • Caustic embrittlement
  • Unit 2.0: Industrial Water II
    • Methods of water softening processes (Principle
    • Construction
    • Working and application of the following processes: Lime soda process (cold and hot)
    • Zeolite process
    • Ion exchange process
  • Unit 3.0: Steam and Steam Generators
    • Steam: Properties
    • Uses and types of steam
    • Steam generator: Classification of boilers
    • Comparison of boilers based on capacity
    • Fuel
    • Design and application
    • Different components of boiler
    • Construction and working of: Lancashire boiler
    • Babcock and Wilcox boiler
    • Function of boiler mountings and accessories
    • Boiler act: Indian boiler act and duties of boiler inspector
  • Unit 4.0: Refrigeration
    • Refrigeration: Concept
    • Unit of refrigeration
    • Coefficient of performance (COP)
    • Numerical
    • Types of primary and secondary refrigerants: Selection criteria of refrigerants
    • Refrigeration cycle: Reverse Carnot cycle
    • Vapor compression and absorption cycle
  • Unit 5.0: Air and Psychrometry
    • Concept and application of process air and instrument air
    • Psychrometry: Dry bulb temperature
    • Wet bulb temperature
    • Dew point temperature
    • Adiabatic saturation temperature
    • Humidity
    • Specific humidity
    • Specific volume
    • Relative humidity
    • Psychrometric chart
    • Numericals
    • Psychrometric process: Humidification and dehumidification
    • Cooling tower: Principle
    • Construction and working of induced draft and forced draft
  • Unit 6.0: Plant Maintenance
    • Purpose of plant maintenance
    • Types of maintenance: Preventive maintenance
    • Predictive maintenance
    • Corrective maintenance
    • Routine/scheduled maintenance
    • Emergency maintenance
    • Online maintenance and shut down maintenance
    • Duties and responsibility of plant maintenance department
    • Online maintenance of chemical equipment like rotameter etc.

Text/Reference Books:

  1. Engineering Chemistry, P. C. Jain and Dr. Monika Jain, Dhanpatrai Publications, New Delhi, 2008, ISBN-978-87-403-0363-6.
  2. Industrial Water, Powel S. T, Mc. Graw Hill, New York, 2009, ISBN 9781118843727
  3. Thermal Engineering, P. L. Ballaney, Khanna Publication, New Delhi 1975, ISBN9788174090317
  4. A Textbook of Refrigeration and Air Conditioning, Rajput R. K, Kataria S. K. and sons, New Delhi 2003, ISBN13:9789350142554.
  5. Refrigeration: Theory and Applications, James K. Carson, Mc. Graw Hill, New York, 2009, ISBN: 078-87-403-0363-6
  6. Chemical Plant Utilities, Sathiya moorthy Manickkam, Lambert Academic Publishing, October 2016, ISBN: 978-3-659-97828-9
  7. Safe and Efficient Plant Operation and Maintenance, Kraus, Milton N., Mc. Graw Hill Inc. New York US, 1980, ISBN:978-0070107076
  8. Plant maintenance engineering and management, R. K. Jain, Khanna Publication, ISBN: 9789392549090

Program Elective-I: Plant Design and Costing [114607]

  • Unit 1.0: Introduction to Plant Design
    • Introduction to plant design
    • Process design development
    • Types of plant design
    • Comparison of different processes by technical factors
    • Raw materials
    • By-products
    • Plant location
    • Equipment
    • Time factor and process considerations
    • Equipment layout diagram (ELD)
    • CPM & PERT: Principle & objective
    • Application of CPM & PERT for calculation of time duration
  • Unit 2.0: Design Considerations
    • General design considerations
    • Cost: Concept of cost
    • Total cost
    • Fixed cost
    • Variable cost
    • Direct
    • Indirect cost
    • Asset accounting
    • Last in first out & first in first out
    • Cash flow for industrial operations
    • Demand & supply: Laws related to demand & supply
    • Demand & supply schedule
  • Unit 3.0: Cost Estimation
    • Cash flow for industrial operations: Factors affecting investment and production cost
    • Capital investments
    • Estimation of capital investments
    • Cost indices
    • Cost factors in capital investment
    • Organizations for presenting capital investment: Estimates by compartmentalization
    • Estimation of total product of cost direction
    • Production costs
    • Fixed charges
    • Plant overhead costs
    • Financing
    • Interest and investment cost: Types of interests
    • Nominal and effective interest rates
    • Continuous interest
    • Present worth and discount annuities
    • Cost due to interest on investment
    • Source of capital
  • Unit 4.0: Taxes, Insurances
    • Taxes and insurances: Type of taxes: Federal income taxes
    • Insurance-types of insurance self-insurance
  • Unit 5.0: Depreciation
    • Depreciation: Service life
    • Salvage value
    • Present value
    • Methods for determining depreciation
    • Single unit and group depreciation
  • Unit 6.0: Profitability, Alternative Investments and Replacements
    • Profitability standards
    • Discounted cash flow
    • Capitalized cost
    • Pay out period
    • Alternative investments
    • Analysis with small investment increments and replacements
    • Optimum design and design strategy
    • Incremental cost
    • General procedure for determining optimum condition
    • Comparison of graphical and analytical methods
    • Optimum production rates
    • Semi continuous cyclic operation
    • Fluid dynamics
    • Mass transfer

Text/Reference Books:

  1. "Plant Design and Economics for Chemical engineering", Peters. M.S. and Timmerhaus, K.D, 4th Edition, McGraw Hill, Singapore, 1991. ISBN:9780070496132, 0070496137.
  2. "Process Engineering Economics" Schweyer. H.E., McGraw Hill, 1st edition, New York, 1955.
  3. "Optimization of Chemical Processes" Edgar T.F. and Himmelblau D.M., 2nd edition, McGraw Hill, International editions, Chemical Engineering series, 2001. ISBN: 0-07-039359-1.
  4. Process Plant and Equipment Cost Estimation, Kharbanda O.P., Pennwell Corp; Subsequent edition (1 December 1979). ISBN-10: 091046068X, ISBN-13: 978-0910460682.

Open Elective-II: Basic of AI [100615]

  • Unit 1.0: Introduction to AI & Searching Techniques
    • Introduction to artificial intelligence
    • Types of AI and intelligent agents
    • Breadth-first search
    • Depth-first search
    • Hill climbing
    • And its variations
    • Heuristic search techniques: Best-first search
    • A* algorithm
    • Constraint satisfaction problem
    • Means-end analysis
    • Introduction to game playing
    • Min-max
    • And alpha-beta pruning algorithms
  • Unit 2.0: Knowledge Representation
    • Propositional logic
    • First-order predicate logic
    • Resolution principle
    • Unification
    • Semantic nets
    • Conceptual dependencies
    • Frames
    • Scripts
    • And production rules
  • Unit 3.0: Understanding Natural Languages I
    • Components and steps of communication
    • The contrast between formal and natural languages in the context of grammar
    • Chomsky hierarchy of grammars
    • Parsing
    • And semantics
    • Parsing techniques
  • Unit 4.0: Understanding Natural Languages II
    • Context-free and transformational grammar
    • Recursive and augmented transition networks
  • Unit 5.0: AI in Decision Making
    • Utility theory
    • Utility functions
    • Decision networks
    • Sequential decision problems
    • Partially observable Markov decision process (MDPs)
    • Game theory
    • AI solutions for real-time problems using ML
  • Unit 6.0: AI in Reinforcement Learning
    • Passive reinforcement learning (RL) and active RL
    • Generalization in RL
    • Policy search
    • Deep reinforcement learning
    • AI solutions for real-time problems using RL

Text/Reference Books:

  1. Artificial Intelligence: A Modern Approach S. Russell and P. Norvig, Prentice Hall, Third Edition, 2015, ISBN-13: 978-0-13-604259-4, ISBN-10: 0-13-604259-7.
  2. Introduction to Artificial Intelligence & Expert Systems, Patterson Pearson, 1st ed. 2015, ISBN-10: 9332551944, ISBN-13: 978-8120307773.
  3. Intelligent Planning: A decomposition and abstraction-based approach Yang, Q, Springer Verlag, Berlin Heidelberg, 1997. ISBN-10: 354061901, ISBN-13978-3540619017.

Open Elective-II: Electrical and Hybrid Vehicles [100616]

  • Unit 1.0: Introduction
    • Conventional vehicles: Basics of vehicle performance
    • Vehicle power source characterization
    • Transmission characteristics
    • Mathematical models to describe vehicle performance
    • Introduction to hybrid electric vehicles: History of hybrid and electric vehicles
    • Social and environmental importance of hybrid and electric vehicles
    • Impact of modern drive-trains on energy supplies
  • Unit 2.0: Hybrid Electric Drive-trains
    • Hybrid electric drive-trains: Basic concept of hybrid traction
    • Introduction to various hybrid drive-train topologies
    • Power flow control in hybrid drive-train topologies
    • Fuel efficiency analysis
  • Unit 3.0: Electric Drive-trains
    • Electric drive-trains: Basic concept of electric traction
    • Introduction to various electric drive-train topologies
    • Power flow control in electric drive-train topologies
    • Fuel efficiency analysis
    • Electric propulsion unit: Introduction to electric components used in hybrid and electric vehicles
    • Configuration and control of DC motor drives
    • Configuration and control of induction motor drives
    • Configuration and control of permanent magnet motor drives
    • Configuration and control of switch reluctance motor drives
    • Drive system efficiency
  • Unit 4.0: Energy Storage
    • Energy storage: Introduction to energy storage requirements in hybrid and electric vehicles
    • Battery based energy storage and its analysis
    • Fuel cell based energy storage and its analysis
    • Super capacitor based energy storage and its analysis
    • Flywheel based energy storage and its analysis
    • Hybridization of different energy storage devices
  • Unit 5.0: Sizing the drive system
    • Sizing the drive system: Matching the electric machine and the internal combustion engine (ICE)
    • Sizing the propulsion motor
    • Sizing the power electronics
    • Selecting the energy storage technology
    • Communications
    • Supporting subsystems
  • Unit 6.0: Energy Management Strategies
    • Energy management strategies: Introduction to energy management strategies used in hybrid and electric vehicles
    • Classification of different energy management strategies
    • Comparison of different energy management strategies
    • Implementation issues of energy management strategies
    • Case studies: Design of a hybrid electric vehicle (HEV)
    • Design of a battery electric vehicle (BEV)

Text/Reference Books:

  1. C. Mi, M. A. Masrur and D. W.Gao, "Hybrid Electric Vehicles: Principles and Applications with Practical Perspectives", John Wiley & Sons, 2011.
  2. S. Onori, L. Serrao and G. Rizzoni, "Hybrid Electric Vehicles: Energy Management Strategies", Springer, 2015.
  3. M. Ehsani, Y. Gao, S. E. Gay and A. Emadi, "Modern Electric, Hybrid Electric, and FuelCell Vehicles: Fundamentals, Theory, and Design", CRC Press, 2004.
  4. T. Denton, "Electric and Hybrid Vehicles", Routledge, 2016.

Open Elective-II: Industrial Automation [100617]

  • Unit 1.0: Introduction to Industrial Automation
    • Introduction to Industry 4.0 and its components
    • Need of automation in industries
    • Principles and strategies of automation
    • Factory automation
    • Process automation
    • Basic elements of an automated system
    • Structure of industrial automation
    • Advanced automation functions
    • Levels of automations
    • Industrial control systems- Process and discrete system
    • Types of automation system: Fixed
    • Programmable
    • Flexible
    • Integrated automation and its application
    • Different systems used for industrial automation: PLC
    • HMI
    • SCADA
    • DCS
    • Drives
    • Introduction to Internet of Things (IoT) and Industrial Internet of Things (IIOT) and its application in automation
    • Role of robots in automation and its components
    • Fundamentals of automated production lines or transfer lines and its applications
  • Unit 2.0: Sensors and Input Field Devices
    • Analog input devices
    • Electromagnetic relays
    • Contactors
    • Motor starters
    • Manually operated switches
    • Toggle switch
    • Pushbutton switch
    • Knife switch and selector switches
    • Mechanically operated switches
    • Limit switch
    • Temperature switch (Thermostat)
    • Pressure switch
    • Level switch and their symbols
    • Discrete/Digital input devices
    • Construction and working of sensors
    • Proximity sensors- Inductive
    • Capacitive
    • Optical and ultrasonic
    • Advanced sensors- Construction and working of temperature sensors- Thermistor
    • Thermocouple and resistance temperature detector (RTD)
    • Liquid level sensor -Capacitive and ultrasonic
    • Force -Strain/Weight sensors
    • Flow sensors turbine flow sensor
    • Pressure sensors- Linear variable
    • Differential transformer (LVDT)
    • Inclination sensor -Inclinometer
    • Acceleration sensor- Accelerometer
    • Angular and linear position sensor
  • Unit 3.0: Actuators and Output Devices
    • Introduction to actuators
    • Classification of actuators
    • Mechanical actuators -Translational and rotational motion
    • Kinematic chains
    • Cams
    • Gears
    • Belt and chain drives
    • Bearings
    • Hydraulic and pneumatic actuators
    • Linear and rotary actuators
    • Single and double acting cylinder
    • Directional
    • Process and pressure control valves
    • Electrical actuators
    • Electromechanical actuators
    • Construction
    • Working and application of stepper motors
    • AC/DC servo motors
    • BLDC motor (very brief)
    • Electrohydraulic actuators-Solenoid valve
    • Thermal actuators and magnetic actuators
    • Selection of actuators
  • Unit 4.0: Other output Devices
    • Other output devices- Indicators
    • Alarms
    • Pilot lights
    • Buzzers
    • Valves
    • Motor starters
    • Horns and alarms
    • Stack lights
    • Control relays
    • Pumps and fans
  • Unit 5.0: Control System
    • Open and closed loop system
    • Their transfer function
    • First order and second order system and their output response and parameters
    • Types of control
    • On-off
    • Feed forward
    • Open loop and closed loop control and transfer function
    • Controllers in closed loop control
    • Proportional controller (P controller)
    • Integral controller (I controller)
    • Derivative controller (D- controller)
    • P-I controller
    • P-D controller
    • PID controller
  • Unit 6.0: SCADA and DCS
    • Introduction
    • Need
    • Benefits and typical applications of SCADA and DCS
    • SCADA architecture
    • Remote terminal units (RTUs)
    • Master terminal units
    • Various SCADA editors
    • Communication protocols for SCADA
    • Comparison of SCADA with DCS
    • Interfacing SCADA system with PLC
    • Typical connection diagram
    • Object linking and embedding for process control (OPC) architecture
    • Creating SCADA screen
    • HMI for simple object
    • Steps for linking SCADA object (defining tags and items, creating trends etc.,) with PLC ladder program using OPC
    • Configuring simple applications using SCADA: Traffic light control
    • Water distribution
    • Pipeline control
    • Power generation
    • Transmission and distribution etc.
    • Procedure to maintain the SCADA based PLC system

Text/Reference Books:

  1. Industrial Automation with SCADA: Concepts, Communications and Security, K S Manoj Notion Press; 1st edition, 2019, ISBN-13: 978-1684668281.
  2. Introduction to Industrial Automation, Stamatios Manesis, George Nikolakopoulos, CRC Press, 1st edition, 2020, ISBN 9780367571832.
  3. Industrial Automation Using PLC SCADA & DCS, R.G.Jamkar, Global Education Limited, 2018, ISBN-13: 978-8193579954.
  4. Industrial automation and Process control, Stenerson Jon, PHI Learning, New Delhi, 2003, ISBN: 9780130618900.
  5. Control System, Nagrath & Gopal, New Age International Pvt Ltd, ISBN: 9789386070111.
  6. Industrial automation and Process control, Stenerson Jon PHI Learning, New Delhi, 2003, ISBN: 9780130618900.
  7. Programmable Logic Controller, Jadhav, V. R., Khanna publishers, New Delhi, 2017, ISBN: 9788174092281.
  8. Programmable Logic Controllers and Industrial Automation – An introduction, Mitra, Madhuchandra; Sengupta, Samarjit Penram International Publication, 2015, ISBN: 9788187972174.
  9. Supervisory Control and Data Acquisition, Boyar, S. A., ISA Publication, USA, ISBN: 978-1936007097
  10. Practical SCADA for industry Bailey David; Wright Edwin Newnes (an imprint of Elsevier), UK 2003, ISBN: 0750658053.

Open Elective-II: Basic of ML [100618]

  • Unit 1.0: Introduction to Machine Learning and Fundamentals
    • Introduction to machine learning
    • Supervised learning
    • Unsupervised learning
    • And reinforcement learning
    • Machine learning basics: Capacity
    • Over fitting
    • And under fitting
    • Hyperparameters and validation sets
    • Bias & variance
  • Unit 2.0: Bayesian Concepts and Decision Trees
    • Bayes theorem
    • Concept learning
    • Maximum likelihood classifier
    • Bayesian belief networks
    • Decision-trees
    • Univariate and multivariate decision tree
    • Network equivalent of decision trees
    • Overfitting
    • And evaluation
  • Unit 3.0: Instant-Based Learning and Support Vector Machines
    • Logistic regression
    • Support vector machine (SVM)
    • Kernel function and kernel SVM
    • Instant-based learning: k- nearest neighbour
    • Locally weighted regression
    • Radial basis functions
    • Case based learning
  • Unit 4.0: Clustering
    • Clustering: k-means
    • Adaptive hierarchical clustering
    • And Gaussian mixture model
  • Unit 5.0: Neural Networks
    • Neural network: Perception
    • Multilayer network
    • Back propagation
  • Unit 6.0: Applications and Case Studies of Machine Learning
    • Applications of machine learning (case studies): Business analytics
    • Natural language processing
    • Computer vision
    • Internet of Things
    • Bio-informatics etc.

Text/Reference Books:

  1. Machine Learning, Tom M. Mitchell, McGraw-Hill Education (India) Private Limited, 2013, ISBN 0070428077.
  2. Foundations of Machine Learning, Mohri, M., Rostamizadedh, A., and Talwalkar, A. The MIT Press, 2012, 9, ISBN 78-0-262-01825-8.
  3. Fundamentals of Machine Learning, Dr. M. Gopal, McGraw Hill Education (India), ISBN:978-9353161837.
  4. Machine Learning: Principles and Algorithms, P. K. Pattanayak, Universities Press (India) ISBN: 978-9386235513.

Open Elective-II: AR VR Technology [100619]

  • Unit 1.0: Introduction to Immersive Technologies
    • Overview of immersive technologies: Augmented reality (AR)
    • Virtual reality (VR)
    • Mixed reality (MR)
    • And extended reality (XR)
    • Applications in education
    • Healthcare
    • Entertainment
    • And industry
    • Key differences between AR
    • VR
    • MR and XR
    • Challenges and future trends
  • Unit 2.0: Hardware and Software Requirements
    • AR/VR headsets and displays (e.g.
    • Oculus
    • HoloLens
    • Etc.)
    • Sensors: Motion
    • Depth
    • And tracking systems
    • Input devices: Controllers
    • Gloves
    • And mobile devices
    • System specifications of central processing unit (CPU)
    • Graphical processing unit (GPU)
    • Random access memory (RAM)
    • Graphics card and storage considerations
    • AR/VR development platforms (overview): Unity
    • Unreal Engine
    • SDKs and APIs for AR
    • VR: Vuforia
    • ARKit
    • ARCore
  • Unit 3.0: Unity Software
    • Introduction to Unity software and its features
    • System requirements for Unity installation
    • Unity's interface and basic functionalities
    • Assets and its types
    • Sources of 2D and 3D assets
    • Windows in Unity
    • Game objects and their types
    • Rigid bodies and colliders
    • Physics-based interactions
    • Software development kit (SDK)-Vuforia
  • Unit 4.0: Augmented Reality (AR)
    • Principles of AR and its working mechanisms
    • AR image and object recognition techniques
    • Location-based and marker-based AR
    • Introduction to various AR web-based applications
    • AR design on Blippar or similar platforms
    • Testing and publishing AR applications
  • Unit 5.0: AR Design and Development
    • Anchoring and detecting objects in AR
    • Development of AR application marker-based and marker less in Unity
    • Deployment of AR app on Android/iOS devices
  • Unit 6.0: Virtual Reality (VR)
    • Principles and technical requirements of virtual reality
    • Types of VR systems: Non-immersive
    • Semi-immersive
    • And fully immersive
    • Key elements of immersive VR experience
    • Levels of immersion in VR environment
    • 360-degree media

Text/Reference Books:

  1. Learning Path Complete VR & AR Development with Unity, Jesse Glover & J. Linowes, Packt Publishers Ltd., ISBN-101838648186, ISBN-13: 978-1838648183.
  2. Mastering AR Development with Unity, Indika Wijesooriya, BPB.
  3. 3D Game Development with Unity, Franz Lanzinger, CRC Press, ISBN-10: 0367349183, ISBN-13: 978-0367349189.
  4. AR with Unity; AR Foundation - A Practical Guide, Jonathan Linowes. Packt Publishers Ltd., ISBN: 978-1-83898-259-1.

Open Elective-II: Micro Electro Mechanical System (MEMS) Technology [100620]

  • Unit 1.0: Introduction to Mems and Microfabrication
    • History of MEMS development
    • Characteristics of MEMS
    • Miniaturization
    • Microelectronics integration
    • Mass fabrication with precision
    • Micro fabrication
    • Microelectronics fabrication process: Silicon based MEMS processes
    • New material and fabrication processing
    • Points of consideration for processing
  • Unit 2.0: Electrical and Mechanical Properties of Mems Materials
    • Conductivity of semiconductors
    • Crystal plane and orientation
    • Stress and stain: Definition
    • Relationship between tensile stress and stain
    • Mechanical properties of silicon and thin films
    • Flexural beam bending analysis under single loading condition
    • Types of beam: Deflection of beam
    • Longitudinal stain under pure bending
    • Spring constant
    • Tensional deflection
    • Intrinsic stress
    • Resonance and quality factor
  • Unit 3.0: Sensing and Actuation
    • Electrostatic sensing and actuation: Parallel plate capacitor
    • Application-Inertial sensor
    • Pressure sensor and tactile sensor
    • Parallel plate actuator and comb drive
    • Thermal sensing and actuations: Thermal sensors
    • Thermal actuators
    • Application-Inertial
    • Flow and infrared sensors
    • Piezoresistive sensors: Piezoresistive sensor material
    • Stress in flexural cantilever and membrane- Application-Inertial
    • Pressure
    • Flow and tactile sensor
    • Piezoelectric sensing and actuation: Piezoelectric material properties-quartz-PZT-PVDF ZnO
    • Application-Inertial
    • Acoustic
    • Tactile
    • Flow-surface elastic waves
    • Magnetic actuation: Micro magnetic actuation principle
    • Deposition of magnetic materials
    • Design and fabrication of magnetic coil
  • Unit 4.0: Bulk and Surface Micromachining
    • Anisotropic wet etching
    • Dry etching of silicon
    • Deep reactive ion etching (DRIE)
    • Isotropic wet etching
    • Basic surface micromachining process
    • Structural and sacrificial material
    • Stiction and anti stiction methods
    • Foundry process
  • Unit 5.0: Polymer Mems
    • Polymers in MEMS
    • Polymide-SU-8
    • Liquid crystal polymer (LCP): PDMS
    • PMMA
    • Parylene
    • Flurocorbon
    • Application-Acceleration
    • Pressure
    • Flow and tactile sensors
  • Unit 6.0: Optical Mems
    • Optical MEMS: Refraction
    • Diffraction
    • MOEMS components
    • Digital mirror display (DMD)
    • Grating light valve (GLV)
    • Optical scanners

Text/Reference Books:

  1. Foundations of MEMS, Chang Liu, Pearson International Edition, 2006, ISBN-978-0132497367.
  2. RF MEMS Theory, Design and Technology, Gaberiel M.Rebiz, John Wiley & Sons, 2003, ISBN-978-0471201694.
  3. Introduction to nanotechnology, Charles P.Poole, Frank J.Owens, John Wiley & sons, 2003, ISBN-13: 978-0471079354.
  4. Microsensors, MEMS and Smart devices, Julian W.Gardner, Vijay K Varadhan, John Wiley & sons, 2001, ISBN-978-0471861096.

Open Elective-II: Electronic Product Design & Packaging [100621]

  • Unit 1.0: Essentials of Electronic Product Design & Packaging
    • Introduction to electronic product design
    • Electronic packaging fundamentals
    • Printed circuit board (PCB) design and fabrication
    • Thermal
    • Mechanical
    • And EMI/EMC considerations
    • Prototyping
    • Testing
    • And reliability
  • Unit 2.0: Design Aspects of Semiconductor Packaging
    • Overview of semiconductor packaging types: Dual in-line package (DIP)
    • QFP
    • BGA
    • CSP
    • And 3D ICs
    • Wire bonding
    • Flip-chip
    • And through-silicon vias (TSVs)
    • Trends in package miniaturization and integration
    • Thermal and mechanical design considerations: Heat dissipation in semiconductor packages
    • Stress and strain due to thermal cycling
    • Package warpage and delamination issues
    • Electrical design aspects: Signal integrity and power integrity
    • Parasitics: resistance
    • Capacitance
    • And inductance
    • High-speed design challenges and mitigation techniques
    • Materials and substrate technologies: Die attach materials
    • Encapsulants
    • And underfills
    • Organic vs ceramic substrates
    • Reliability and compatibility of packaging materials
    • Packaging process flow and testing: Wafer-level packaging and assembly steps
    • Burn-in
    • Electrical
    • And reliability testing
    • Design for testability (DFT) in semiconductor packaging
  • Unit 3.0: Dicing & Inspection
    • Wafer dicing techniques: Mechanical sawing (blade dicing)
    • Laser dicing and stealth dicing
    • Plasma dicing (dry etching methods)
    • Comparison of dicing methods based on precision
    • Cost
    • And material type
    • Dicing process parameters and optimization: Cut depth
    • Kerf width
    • And feed rate
    • Cooling and lubrication during dicing
    • Minimizing chipping
    • Cracking
    • And contamination
    • Wafer mounting and handling: Use of dicing tapes and frames
    • Wafer alignment and chucking
    • ESD precautions and cleanroom requirements
    • Post-dicing cleaning and debris removal: Cleaning techniques (wet
    • Dry
    • CO2 snow)
    • Particle contamination control
    • Inspection for surface damage or residues
    • Wafer inspection and defect analysis: Visual and automated optical inspection (AOI)
    • Surface and edge defect detection
    • Use of SEM
    • X-ray
    • And infrared imaging for deeper inspection
    • Yield analysis and defect classification
  • Unit 4.0: Conventional Packaging
    • Introduction to conventional packaging types: Dual in-line package (DIP)
    • Surface mount device (SMD)
    • Chip-on-board (COB) and leadframe-based packaging
    • Through-hole vs. surface-mount technologies
    • Materials used in conventional packaging: Encapsulants and molding compounds
    • Leadframe materials (e.g.
    • Copper
    • Brass
    • And alloys)
    • Substrate materials: epoxy
    • Ceramic
    • And organic laminates
    • Packaging assembly processes: Die attach methods: eutectic bonding
    • Adhesive bonding
    • Wire bonding techniques: gold
    • Aluminum
    • And copper wire
    • Molding and encapsulation processes
    • Electrical and thermal design in conventional packaging: Signal integrity in conventional packages
    • Heat dissipation and thermal management strategies
    • Thermal cycling and reliability considerations
    • Testing and reliability of conventional packages: Standard testing methods: electrical
    • Thermal
    • And mechanical tests
    • Reliability testing: accelerated life testing (ALT)
    • Burn-in tests
    • Failure analysis techniques: decapsulation
    • Cross-sectioning
  • Unit 5.0: Bonding, Sealing
    • Bonding techniques in semiconductor packaging: Wire bonding (gold
    • Aluminum
    • Copper)
    • Flip-chip bonding and solder bumping
    • Adhesive bonding and thermo-compression bonding
    • Laser and ultrasonic bonding methods
    • Sealing methods in semiconductor packaging: Molding and encapsulation processes
    • Hermetic sealing and its importance for high-reliability applications
    • Use of sealing materials: epoxy
    • Silicone
    • And elastomers
    • Advanced sealing techniques for 3D and wafer-level packaging
    • Reliability and testing in bonding and sealing: Mechanical and thermal stress testing in bonded and sealed packages
    • Failure analysis methods: decapsulation
    • Cross-sectioning
    • And SEM analysis
  • Unit 6.0: Advanced Packaging
    • Advanced packaging technologies: System-in-package (SiP) and package-on-package (PoP) technologies
    • 3D integrated circuits (3D ICs) and through-silicon vias (TSVs)
    • Wafer-level packaging (WLP) and fan-out wafer-level packaging (FOWLP)
    • Hybrid and multi-chip module (MCM) integration
    • Thermal and electrical considerations in advanced packaging: Thermal management techniques in advanced packaging (heat sinks
    • Thermal vias)
    • Electrical performance challenges: signal integrity and power delivery in high-density packages
    • Power dissipation and interconnect strategies in 3D packaging
    • Reliability testing standards for advanced packaging (e.g.
    • JEDEC
    • MIL-STD)

Text/Reference Books:

  1. Electronic Packaging and Interconnection Handbook, Charles Harper, ISBN-13, 978-0071430487, McGraw-Hill Professional, Edition: 4, Publication Date: 16 November 2004.
  2. "Electronic Product Design" A.E. Ward and J.A.S. Angus Chapman and Hall, ISBN: 0-412-63200-4, 1996.
  3. Electronic Product Design, S.D. Mehta, S Chand Publishing ISBN: 9788121936156, 2011.
  4. Semiconductor Packaging Material Interaction and reliability, Chen, Andrea & Lo, Randy Hsiao-Yu, ISBN-13; 978-1439862056, CRC Press, 10 October 2011.
  5. Semiconductor Device Packaging, John H. Lau, Springer, ISBN-10: 9811613753, ISBN-13: 978-9811613753.
  6. Microelectronics Packaging Handbook Part 1, Part 2, Part 3, R. R. Tumalla, Springer US, ISBN-13: 978-0412084416, ISBN-13: 978-0412084416, ISBN-13: 978-0412084515.
  7. Advanced Electronics Packaging, Richard K. Ulrich Wiley-IEEE Press, ISBN-13: 978-0471466093.
  8. Integrated Circuit Packaging, Assembly and Interconnection, William J. Greig, Springer, ISBN-13: 978-0387281537.
  9. 3D IC Integration and Packaging, John H Lau, McGraw-Hill Education, ISBN-13: 978-0071848060.

Open Elective-II: 3D Printing and Design [100622]

  • Unit 1.0: Additive Manufacturing Introduction and CAD-CAM for 3D Printing
    • Additive v/s conventional manufacturing processes
    • Classification of 3D printing processes
    • Working principle of various 3D printing processes- Fused deposition modeling (FDM)
    • Stereo lithography (SLA)
    • Selective laser sintering (SLS)
    • Binder jetting
    • Material jetting
    • Direct energy deposition and laminate object manufacturing
    • Additive manufacturing application domains: Aerospace
    • Electronics
    • Health care
    • Defense
    • Automotive
    • Construction
    • Food processing
    • Machine tools
    • Product design and prototyping
    • Reverse engineering for 3D printing
    • CAD-CAM and its integration
    • CAD- Part and surface modeling
    • CAD file formats
    • Process chain for 3D printing
    • STL interface specification
    • STL data generation
    • STL data manipulation
    • Advantages and limitations of STL file format
    • Open files
    • Repair of STL files
    • Alternative 3D printing interfaces
    • Part orientation and support generation
    • Factors affecting part orientation
    • Various models for part orientation determination
    • The function of part supports
    • Support structure design
    • Automatic support structure generation
    • Model slicing and contour data organization
    • Direct and adaptive slicing: Identification of peak features
    • Adaptive layer thickness determination
    • Tool path generation
  • Unit 2.0: 3D Printing Materials
    • Various forms of 3D printing raw material- Liquid
    • Solid
    • Wire
    • Powder
    • Popular FDM
    • SLA
    • SLS
    • Binder jetting
    • Material jetting and direct energy deposition 3D printing materials
    • Polymers
    • Metals
    • Non-metals
    • Ceramics
    • Polymers and their properties
    • Powder preparation and their desired properties
    • Choosing the right 3D printing material on the basis of performance requirements and material properties
  • Unit 3.0: Solid based 3D Printing Processes
    • Basic principle and working of fused deposition modeling (FDM) process
    • Construction details and working of established FDM based 3D printers for plastics parts
    • 3D printer software- Fusion 360
    • Solidworks
    • Onshape
    • Tinkercad
    • UltimakerCura
    • MeshLab
    • Simplyfy 3D
    • Repetier host
    • Slic3r
    • Etc. use and operation of anyone
    • 3D scanners and working
    • Producing a part using FDM based 3D printer
    • Liquefaction
    • Solidification and bonding
    • Laminated object manufacturing process
    • Cost estimation of FDM 3D printed component
  • Unit 4.0: Liquid based 3D Printing Processes
    • Photo polymerization
    • Principle and working of stereo lithography apparatus
    • SLA based 3D printing processes
    • SLA based 3D printing process materials
    • Scanning techniques
    • Curing processes
    • Cost estimation of SLA 3D printed component
  • Unit 5.0: Powder based 3D Printing Processes
    • Powder fusion mechanism
    • Principle and working of selective laser sintering (SLS) process
    • SLS based 3D printers
    • Laser engineering net shaping process
    • Electron beam melting
    • Binder jet 3D printing
    • Materials and process parameters for SLS based 3D printing processes
    • Cost estimation of SLS based 3D printed component
  • Unit 6.0: Post Processing and Quality
    • Need of post processing: Functional and aesthetic reasons
    • Steps of post processing: Cleaning/support removal
    • Fixing
    • Curing or hardening
    • Surface finishing
    • Colouring
    • Cleaning: Support removal (FDM and material jetting)
    • Powder removal (SLS and powder bed fusion)
    • Washing (SLA and photo polymerisation)
    • Fixing: Filling
    • Gluing
    • Welding
    • Surface finishing: Sanding
    • Polishing
    • Tumbling
    • Hydro dipping
    • Epoxy coating
    • Electro plating
    • Vapour smoothing-acetone treatment
    • Colouring
    • Coating
    • Priming and painting
    • Inspection and testing: Digital
    • Visual
    • Physical
    • Defects and their causes

Text/Reference Books:

  1. Fundamentals and Applications of Additive Manufacturing, Sharad K. Pradhan, Ankit Nayak, Surendra Singh Thakur, Vishal Francis, Aniket Nagargoje CRC Press, Taylor & Francis, ISBN 9781032898049.
  2. Understanding Additive Manufacturing: Rapid Prototyping, Rapid Tooling, Rapid Manufacturing Andreas Gebhardt, Hanser Publisher, 2011, ISBN: 156990507X, 9781569905074.
  3. 3D Printing and Design, Sabrie Soloman, Khanna Publishing House, Delhi, ISBN: 9789386173768.
  4. 3D Printing and Rapid Prototyping- Principles and Applications, C.K. Chua, Kah Fai Leong World Scientific, 2017, ISBN: 9789813146754.
  5. Getting Started with 3D Printing: A Hands-on Guide to the Hardware, Software, and Services Behind the New Manufacturing Revolution, Liza Wallach Kloski, Nick Kloski Make Community, LLC; 2nd edition, 2021, ISBN: 9781680450200.

Heat Transfer Operation Lab [114601P]

Perform any 10 Experiments

  • 1. Determination of thermal conductivity of metal rod.
  • 2. Determination of thermal conductivity of liquid.
  • 3. Determination of thermal conductivity of insulating materials
  • 4. Determination of thermal conductivity of composite wall.
  • 5. Determination of heat transfer coefficient for natural convention
  • 6. Determination of heat transfer coefficient for forced convention.
  • 7. Determination heat transfer coefficient for Drop wise condensation.
  • 8. Determination heat transfer coefficient for film wise condensation.
  • 9. Determination of emissivity for given material.
  • 10. Determine Steafan Boltzmann's constant
  • 11. Determination of overall heat transfer coefficient for Shell & Tube heat exchanger for Co- current flow.
  • 12. Determination of overall heat transfer coefficient for Shell & Tube heat exchanger for Counter- current flow.
  • 13. Determination of overall heat transfer coefficient for Double pipe heat exchanger for Counter- current flow.
  • 14. Design heat exchanger using given software e.g. CAD
  • 15. Determination of efficiency of given fin.
  • 16. Determination of overall heat transfer coefficient of evaporator.
  • 17. Design evaporator using given software.

Chemical Reaction Engineering Lab [114602P]

Perform any 10 Experiments

  • 1. Determination of activation energy of saponification of ethyl acetate and sodium hydroxide at various temperatures.
  • 2. Determination of the activation energy of the reaction by hydrolysis of methyl acetate at various temperatures
  • 3. Determination of Arrhenius rate constants for acidic hydrolysis of methyl acetate at various temperatures.
  • 4. Determination of Arrhenius rate constant for acidic hydrolysis of ethyl acetate at various temperatures.
  • 5. Determination of the rate constant for the saponification reaction of ethyl acetate and sodium hydroxide
  • 6. Determination of the void volume of a catalyst particle.
  • 7. Determination of the solid density of a catalyst particle
  • 8. Determination of the porosity of a catalyst particle
  • 9. Determination of order of reaction for saponification of ethyl-acetate with sodium hydroxide.
  • 10. Determination of the order of reaction for acidic hydrolysis of methyl acetate.
  • 11. Determination of the kinetics of the reaction between ethyl acetate and sodium hydroxide in an isothermal batch reactor
  • 12. Determination of the kinetics of saponification of ethyl acetate and sodium hydroxide in a Plug Flow Reactor.
  • 13. Determination of the kinetics of saponification of ethyl acetate and sodium hydroxide in a continuous stirrer tank reactor
  • 14. Determination of rate constant by the half-life period of the saponification reaction between ethyl acetate and sodium hydroxide in an isothermal batch reactor
  • 15. Determination of kinetics of Bio-diesel synthesis from vegetable oils by Trans esterification.
  • 16. The performance of three equal volumes of CSTR's in series for the saponification of ethyl acetate and sodium hydroxide reactions.

Simulation Software for Chemical Engineering Lab [114603P]

Perform any 10 Experiments

  • 1. *Installation of given software and interact with its interface.
  • 2. Simulation of multicomponent distillation using available simulation software.
  • 3. Performing sensitivity analysis for process parameters using available simulation software.
  • 4. Perform cost estimation for a binary distillation using available simulation software.
  • 5. Simulation of heat exchanger to calculate heat load using available software.
  • 6. Simulation of single-phase fluid flow using ANSYS Fluent or available software.
  • 7. Simulation of multiphase flow systems using OpenFOAM or available software.
  • 8. Modeling of mass transfer and chemical reaction in a reactor using COMSOL Multi physics or available software.
  • 9. Performing basic data analysis of chemical process data using python
  • 10. Plotting and Interpreting Chemical Process Data Using MATLAB
  • 11. Applying linear regression on experimental data using Python
  • 12. Using GAMS solve simple process optimization problem.
  • 13. Performing statistical analysis using Python libraries (NumPy & Pandas)
  • 14. Implementing a fault detection model for process data using Python (Scikit-Learn)
  • 15. Comparing AI model vs. traditional model performance for process prediction in MATLAB.

NPTEL Courses-I Lab [114605]

Details for NPTEL Courses-I Lab will be provided by the department

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