Abhi PYQ

6th Semester Syllabus

Biomedical & Robotics Engineering

Credits Table

Course Title L T P Credits
Robotic Programming and Software Development [117601] 3 0 0 3
Bio MEMS [117602] 3 0 0 3
Signal Conditioning and Data Acquisition System [117603] 3 0 0 3
Employability Skills (Non-Credit) [117604] 3 0 0 0
Program Elective-I [1176XX] 3 0 0 3
Open Elective-II [1006XX] 3 0 0 3
Robotic Programming and Software Development Lab [117601P] 0 0 2 1
Signal Conditioning and Data Acquisition System Lab [117603P] 0 0 2 1
NPTEL Courses-I Lab [117605P] 0 0 4 2
TOTAL 19

Theory Subjects

Lab Subjects

Robotic Programming and Software Development [117601]

  • Unit 1.0: Introduction to Robot Programming
    • Introduction
    • Types
    • Flex Pendant
    • Lead Through Programming
    • Coordinate Systems Of Robot
    • Robot Controller
    • Major Components
    • Functions
    • Wrist Mechanism
    • Interpolation
    • Interlock Commands
    • Operating Mode Of Robot
    • Jogging
    • Types
    • Robot Specifications
    • Motion Commands
    • End Effectors And Sensors Commands
  • Unit 2.0: Basics of Robot Operating System (ROS)
    • Basics Of Linux And Its General Commands
    • Installation Of ROS
    • Introduction To ROS Architecture
    • General Linux Commands For ROS
    • ROS Nodes
    • ROS Topics
    • ROS File System
    • Catkin Workspace
    • Custom Message Types
    • ROS Services
    • ROS Actions
    • ROS Launch Files
  • Unit 3.0: Robot Languages-VAL I & II
    • Classifications
    • Structures
    • VAL Language Commands
    • Motion Control
    • Hand Control
    • Program Control
    • Industrial Applications
    • Using VAL-I Commands
    • VAL-II Programming
    • Basic Commands
    • Problem Using Conditional Statements
    • Industrial Applications Using VAL-II Commands
  • Unit 4.0: Robot Languages-RAPID & AML
    • RAPID Code Basic Commands
    • Types Of Instructions
    • Types Of Modes Of Operation
    • Routine & Subroutine Command Debugging
    • Syntax
    • Developing Routine For Simple And Frequent Operations Of Industrial Robot
    • AML Language
    • General Description
    • Elements And Functions
    • Statements
    • Constants And Variables
    • Program Control
    • Operating Systems
    • Motion
    • Sensor Commands
    • Data Processing
  • Unit 5.0: Autonomous Navigation
    • Introduction To Sensors (Lidar, Camera, Etc.)
    • Mapping Concepts
    • Localization & Its Concepts
    • Path Planning Techniques & Different Algorithms
  • Unit 6.0: Soft Robotics
    • Introduction To Soft Robotics
    • Robotic Process Automation (RPA)
    • Computer Vision
    • AR & VR In Robotics
    • Virtual Robotics
    • Robot Studio Online Software
    • Singularities
    • Collision Detection
    • Repeatability Measurement Of Robot
    • Robot Economics

Text/Reference Books:

  1. Robot Operating System Cookbook, Kumar Bipin, Packt Publishing, 2018 ISBN 13: 978-1783987443.
  2. Robot Operating System for Absolute Beginners, Lentin Joseph, Aleena Johny, APress; 2nd ed. Edition, 2022 ISBN-13: 978-1484277492.
  3. Programming Robots with ROS: A Practical Introduction to the Robot Operating System, Morgan Quigley, Brian Gerkey, and William D. Smart, Shroff/O'Reilly, 2016 ISBN-13: 978-9352132799.
  4. Industrial Robotics- Technology, Programming, and Applications, Mikell Groover, McGraw-Hill Education / Asia, 1995 ISBN-13: 978-0071004428.
  5. Robotics Technology and Flexible Automation, S. R. Deb and Sankha Deb, McGraw Hill Education, 2017 ISBN-13: 978-0070077911.

Bio MEMS [117602]

  • Unit 1.0: MEMS Overview
    • Introduction To MEMS
    • History Of MEMS Development
    • Sensors And Actuators
    • Salient Features And Branches Of MEMS Technology
    • Introduction And Overview Of Microfabrication Methods
    • Photolithography
    • Thin File Deposition
    • Etching And Microelectronic Fabrication Flow
    • Case Studies Of MEMS Applications
  • Unit 2.0: Fundamentals of Microfluidic Systems
    • Motivation And Introduction To Microfluidic Channel
    • Types Of Microfluidic Channels And Their Working Principle
    • Biocompatible Polymers
  • Unit 3.0: Fabrication Techniques
    • Lithography Techniques
    • X Ray And Ultraviolet For SU 8
  • Unit 4.0: Microfluidic Integration and Lab-on Chip Systems
    • Micro Total Analysis Systems (μTAS)
    • Lab On Chip (LoC) Applications
    • Microfluidic Strategies For LoC And Fabrication Techniques
  • Unit 5.0: Microfluidic Actuation Systems: Micropumps and Valves
    • Micropumps For Microfluidic And LoC Applications
    • Auxiliary Supporting Systems
    • Micropumps And Valves
    • Design
    • Fabrication
    • Working Principles Of Micropumps And Valves
  • Unit 6.0: BioMEMS and Microscale Techniques for Biomedical Applications
    • Microfabricated Sample Extraction And Concentration
    • BioMEMS In Cell Manipulation
    • Case Studies Of BioMEMS Devices

Text/Reference Books:

  1. Bio-MEMS: Technologies and Applications, Wanjun Wang, Steven A. Soper CRC Press; 1st edition (15 December 2006), ISBN-13: 978-0849335327.
  2. Foundation of MEMS, Chang Liu Pearson Education (1 January 2011) ISBN-13: 9788131764756.
  3. Microsystem Design, Stephen D. Senturia, Springer; 1st ed. 2000. Corr. 2nd printing 2004 edition, ISBN: 978-0792372462.
  4. Microsensors, MEMS and Smart devices, Julian W.Gardner, Vijay K Varadhan, John Wiley & sons, 2001. ISBN-978-0471861096.

Signal Conditioning and Data Acquisition System [117603]

  • Unit 1.0: Introduction
    • Data Acquisition And Signal Conditioning
    • Overview
    • Single And Multichannel DAQ
    • Block Diagram And Working
    • ADCs And DACs
    • Working
    • Block Diagram Of The DAQ
    • Simple Applications Like Temperature Reading
    • Systems
    • Motor Speed Control
    • Heart Rate Monitoring Systems
  • Unit 2.0: Signal Conditioning Systems
    • Types Of Signal Conditioning
    • Amplification
    • Isolation
    • Filtering
    • Linearization
    • Classes Of Signal Conditioning
    • Plug-In Board Signal Conditioning
    • Direct Connect Modular
    • Two-Wire Transmitters
    • Distributed I/O
    • Digital Transmitters
    • Field Wiring And Signal Measurement Signal Sources
    • Sources And Types Of Noise
    • Minimizing Noise Cable Shielding And Shield Earthing
    • Grounding Cable Shields
    • Shielded And Twisted-Pair Cable
    • Review Of Nyquist Sampling Theorem
    • Need For Prefiltering (First And Second Order Filters)
    • Digital Quantities
    • Data Conversions And DACs
    • ADCs
  • Unit 3.0: Embedded Microcontrollers-PIC18F/Others
    • Introduction
    • Architecture
    • Assembly And C Language Programming
    • Timers And Counters
    • ADC DAC And Related Examples
    • SPI
    • I2C And Related Examples
  • Unit 4.0: DAQ Systems
    • Introduction
    • Microcontroller DAQ Systems
    • Types Of Hardware Communication For DAQ
    • SPI
    • I2C
    • USB
    • USART And UART
    • Hardware Communication Interface Programming To Connect Data Loggers (RS-232 Interface, RS-485 Interface, Ethernet Interface, USB Interface)
  • Unit 5.0: Data Processing
    • Introduction
    • Data Processing Steps
    • Data Processing Techniques
    • Data Storage Devices
    • Microcontroller Programming For Data Storage
  • Unit 6.0: Analysis
    • Data Retrieving And Plotting Techniques
    • Data Analysis Techniques

Text/Reference Books:

  1. A course in Electrical & Electronic Measurements & Instrumentation, A K Sawhney, Dhampat Rai Publications, 19th edition, 2011. (Module-5).
  2. Sensors and Actuators: Engineering System Instrumentation, Clarence W. de Silva, CRC Press; 2nd edition (28 July 2015) ISBN 978-1466506817.
  3. Data Acquisition Techniques Using PCs, Howard Austerlitz, Academic Press.

Employability Skills (Non-Credit) [117604]

  • Unit 1.0: Goal Setting
    • Career Planning
    • SWOT
    • Resume Using Internet Formats
    • Showcase Portfolios
  • Unit 2.0: Goal Setting- II
    • Personal Grooming
    • Self-Introduction
    • Website Development
  • Unit 3.0: Capacity Development I
    • Interview Skills
    • Group Discussion - Do's & Don'ts
    • Leadership
    • Teamwork
    • How To Interrupt
    • Synthesis And Analysis Of Topics
  • Unit 4.0: Capacity Development II
    • Social Media For Personal Enrichment
    • Body Language
    • Self-Management
    • Emotional Intelligence
  • Unit 5.0: Utilising Potential I
    • Social Networking
    • Social Engagements
    • Volunteering
    • Collaboration & Team-Work
  • Unit 6.0: Utilising Potential II
    • QC-Tools
    • Check Sheets
    • Fishbone Diagram
    • Histogram
    • Pareto Chart
    • Control-Chart
    • Scatter Diagram
    • Stratification
    • Lean Manufacturing
    • Kanban
    • Kaizen
    • Five S
    • Poka-Yoke
    • Quality Circle

Text/Reference Books:

  1. Employability Skills Skills for Employability, Dr. M. Sen Gupta, Innovation Publication Pvt Ltd, 2020 ISBN: 978-81-933819-1-5.
  2. Employability Skills, Dr. Nishith Rajaram Dubey, Anupam Singh, Indra Publishing House, 2023 ISBN - 978-93-93577-68-9.
  3. Organizational Behavior, A. K. Chitale, Rajendra Prasad Mohanty and Dr Nishith Dubey, PHI Learning Pvt Ltd ISBN 978-81-203-4696-3.
  4. Managerial Skills, Dr Nishith Dubey & Prof Gitanjali Shrivastava, Shiva Prakashan, Indore, India, 2010, ISBN 81-7677-100-7.
  5. Body Language, Allan Pease, Pease International PTY. Ltd Australia.
  6. Production and Operations Management Goods & Services approach, Dr S.V Deshmukh, Dr A. K. Chitale and Dr Nishith Dubey, Archers & Elevators publishing house, Bangalore, ISBN 9789386501197.
  7. Emotional Intelligence, Daniel Goleman, Word Press.Com, 9789382563792.
  8. How to win friends and influence people, Dale Carnegie, Srishti Publishers & Distributors, Delhi, India.

Program Elective: Radiological Equipment [117606]

  • Unit 1.0: Science Behind Radiological Equipment
    • Introduction And Types Of Radiation (X-Rays, Gamma Rays, Etc.)
    • Interaction Of Radiation With Matter (Photoelectric Effect, Compton Scattering, Etc.)
    • Radiation Dose Measurement (Gray, Sievert)
    • Radiation Safety Principles (ALARA: As Low As Reasonably Achievable) And AERB, FDA, ICRP Guidelines
    • Shielding Materials And Techniques
    • X-Ray Tubes
    • Detectors And Imaging Sensors
    • Power Supplies And Control Systems
  • Unit 2.0: Operation and Analysis of Various Imaging Equipment
    • Principles Of X-Ray Generation And Detection
    • Applications In Diagnostics (Chest X-Rays, Bone Imaging)
    • Principles Of CT Scanning And 3D Reconstruction
    • Applications In Oncology, Cardiology, And Neurology
    • Principles Of Magnetism And Nuclear Magnetic Resonance (NMR)
    • Applications In Soft Tissue Imaging
    • Principles Of Sound Waves And Transducer Technology
    • Applications In Obstetrics, Cardiology, And Abdominal Imaging
    • Nuclear Medicine
    • Principles Of PET And SPECT Imaging
    • Image Reconstruction Algorithms
    • Noise Reduction And Enhancement Techniques
  • Unit 3.0: Integrate AI and Robotics into Radiological Systems I
    • AI In Radiology
    • Basics Of Machine Learning And Deep Learning
    • AI Applications In Image Analysis - Tumor Detection, Fracture Identification
  • Unit 4.0: Integrate AI and Robotics into Radiological Systems II
    • Robotics In Radiology
    • Robotic Assisted Surgeries And Biopsies
    • Robotics In Radiation Therapy - Cyber Knife, Gamma Knife
    • Integration Of Radiological Systems With Hospital Networks
    • Remote Diagnostics And Tele-Radiology
  • Unit 5.0: Maintenance and Troubleshooting of Radiological Devices
    • Design Principles Of Equipment
    • System Architecture And Component Selection
    • Techniques For Ensuring Image Quality
    • Calibration Of Imaging Systems
    • Common Issues In Radiological Equipment
    • Preventive Maintenance Strategies
    • IEC, AERB, FDA Standards For Radiological Devices
    • Documentation And Certification Processes
  • Unit 6.0: Advancements in Radiological Technology
    • 3D And 4D Imaging Techniques
    • Dual Energy CT And Spectral Imaging
    • PET-MRI
    • SPECT-CT
    • Nanotechnology In Radiology
    • Radiation-Free Imaging Technologies
    • AI For Personalized Medicine

Text/Reference Books:

  1. Robot Operating System Cookbook, Kumar Bipin, Packt Publishing, 2018 ISBN 13: 978-1783987443.
  2. Robot Operating System for Absolute Beginners, Lentin Joseph, Aleena Johny, APress; 2nd ed. Edition, 2022 ISBN-13: 978-1484277492.
  3. Programming Robots with ROS: A Practical Introduction to the Robot Operating System, Morgan Quigley, Brian Gerkey, and William D. Smart, Shroff/O'Reilly, 2016 ISBN-13: 978-9352132799.
  4. Industrial Robotics- Technology, Programming, and Applications, Mikell Groover, McGraw-Hill Education / Asia, 1995 ISBN-13: 978-0071004428.
  5. Robotics Technology and Flexible Automation, S. R. Deb and Sankha Deb, McGraw Hill Education, 2017 ISBN-13: 978-0070077911.

Program Elective: Mobile Robotics and Autonomous Systems [117607]

  • Unit 1.0: Introduction to Mobile Robotics
    • Introduction To Mobile Robotics
    • Robot Locomotion
    • Types Of Locomotion
    • Key Issues In Locomotion
    • Live Reckoning
    • Mobile Robotics Applications
  • Unit 2.0: Robot Navigation & Motion Control
    • Navigation Philosophies
    • Holonomic And Non-Holonomic Constraints
    • Collision Avoidance
    • Path Planning For Navigation
    • Motion Control (Open Loop And Feedback Control)
  • Unit 3.0: Perception and Control
    • Sensors For Mobile Robots
    • Classification
    • Performance And Uncertainty In Sensors
    • Wheel Sensor
    • Heading Sensor
    • Accelerometers
    • Inertial Measurement
    • Motion Sensor
    • Range Sensors
    • Vision Sensor
    • Basics Of Computer Vision And Image Processing
    • Image To Perception
    • Perception To Control
  • Unit 4.0: Localization and Mapping
    • Control Localization And Decomposition Techniques
    • Localization Problem And Challenges
    • Map Representation
    • Probabilistic Map-Based Localization
    • Simultaneous Localization And Mapping (SLAM)
    • Autonomous Map Building
  • Unit 5.0: Planning of Autonomous Systems
    • Path Planning Algorithms Overview
    • A-Star
    • Dijkstra
    • Voronoi Diagrams
    • Probabilistic Roadmaps (PRM)
  • Unit 6.0: Navigation of Autonomous Systems
    • Rapidly Exploring Random Trees (RRT)
    • Markov Decision Processes (MDP)

Text/Reference Books:

  1. Mobile Robotics, Alonzo Kelly, Cambridge University Press, 1st Edition, 2013; ISBN-13: 978-1107031159.
  2. Introduction to Autonomous Mobile Robots, Roland Siegwart, MIT Press, 2nd Edition, 2011 ISBN 13: 978-0262015356.
  3. Designing Autonomous Mobile Robots, John M. Holland, Newnes Publisher, 2004 ISBN-13: 978-0750676830.
  4. Programming Robots with ROS: A Practical Introduction to the Robot Operating System, Morgan Quigley, Brian Gerkey, and William D. Smart, Shroff/O'Reilly, 2016 ISBN-13: 978-9352132799.
  5. Industrial Robotics- Technology, Programming, and Applications, Mikell Groover, McGraw-Hill Education / Asia, 1995 ISBN-13: 978-0071004428.

Program Elective: Mechatronics [117608]

  • Unit 1.0: Fundamentals of Mechatronics
    • Introduction To Mechatronics System
    • Basic Building Blocks Of Mechatronic Systems
    • Key Elements Mechatronics System
    • Mechatronics Design Process
    • Types Of Design
    • Traditional And Mechatronics Designs
    • Advanced Approaches In Mechatronics
    • Mechatronics In Home, Office And Industry Automation
    • Scope Of Mechatronics
  • Unit 2.0: Basic System Models & Modelling
    • Introduction
    • Model Categories
    • Model Development
    • Structural Modelling
    • Physical Modelling
    • Experimental Modelling
    • Model Verification
    • Model Validation
    • Model Simplification
    • Mathematical Models
    • Mechanical System Building Blocks
    • Electrical System Building Blocks
    • Fluid Power System Building Blocks
  • Unit 3.0: Sensors and Actuators
    • Sensor Measurement
    • Classification Of Sensors
    • Sensor Application In Medicine
    • Sensor-Static & Dynamic Characteristics
    • Sensor Types- Displacement, Position, Proximity, Velocity, Motion, Force, Acceleration, Torque, Fluid Pressure, Liquid Flow, Liquid Level, Temperature And Light Sensors
    • Transducers
    • Types Of Transducers
    • Selection Criteria Of Sensors & Actuators For Mechatronic Systems
  • Unit 4.0: Actuation Systems
    • Basic Principles And Elements Actuating Systems
    • Hydraulic And Pneumatic Actuating Systems
    • Mechanical Actuating Systems And Electrical Actuating Systems
  • Unit 5.0: Data Acquisition Systems
    • Analog To Digital And Digital To Analog Conversions
    • Digital Signal Processing - Data Flow In DSPs
    • Block Diagrams
    • Typical Layouts
    • Interfacing Motor Drives
  • Unit 6.0: Design of Mechatronics Systems
    • Industrial Robotic Arm For Manufacturing
    • Electronic Stability Control (ESC) System
    • Robotic-Assisted Surgery
    • Wearable Health Monitoring Systems

Text/Reference Books:

  1. Mechatronics: Electronic Control Systems in Mechanical and Electrical Engineering, W. Bolton, Pearson Education, 2023, ISBN-10: 8177582844.
  2. Mechatronics System Design, Devdas Shetty, Richard A. Kolk, Cengage Learning, 2011 ISBN-10: 8131501191.
  3. Mechatronic Systems Modeling and simulation, Georg Pelz, John wiley and sons Ltd, 2003.
  4. Mechatronics, Robert H. Bishop, CRC Press Inc, 2005, ISBN-10: 0849363586.
  5. Mechatronics A Foundation Course, DE SILVA, Taylor and Francis, 2010, ISBN-10: 9781138569553.

Open Elective: Basic of AI [100615]

  • Unit 1.0: Introduction to AI & Searching Techniques
    • Introduction To Artificial Intelligence
    • Types Of AI And Intelligent Agents
    • Breadth-First Search
    • Depth-First Search
    • Hill Climbing And Its Variations
    • Heuristic Search Techniques
    • Best-First Search
    • A* Algorithm
    • Constraint Satisfaction Problem
    • Means-End Analysis
    • Introduction To Game Playing
    • Min-Max And Alpha-Beta Pruning Algorithms
  • Unit 2.0: Knowledge Representation
    • Propositional Logic
    • First-Order Predicate Logic
    • Resolution Principle
    • Unification
    • Semantic Nets
    • Conceptual Dependencies
    • Frames
    • Scripts And Production Rules
  • Unit 3.0: Understanding Natural Languages I
    • Components And Steps Of Communication
    • The Contrast Between Formal And Natural Languages In The Context Of Grammar
    • Chomsky Hierarchy Of Grammars
    • Parsing And Semantics
    • Parsing Techniques
  • Unit 4.0: Understanding Natural Languages II
    • Context-Free And Transformational Grammar
    • Recursive And Augmented Transition Networks
  • Unit 5.0: AI in Decision Making
    • Utility Theory
    • Utility Functions
    • Decision Networks
    • Sequential Decision Problems
    • Partially Observable Markov Decision Process (MDPs)
    • Game Theory
    • AI Solutions For Real-Time Problems Using ML
  • Unit 6.0: AI in Reinforcement Learning
    • Passive Reinforcement Learning (RL) And Active RL
    • Generalization In RL
    • Policy Search
    • Deep Reinforcement Learning
    • AI Solutions For Real-Time Problems Using RL

Text/Reference Books:

  1. Artificial Intelligence: A Modern Approach S. Russell and P. Norvig, Prentice Hall, Third Edition, 2015, ISBN-13: 978-0-13-604259-4, ISBN-10: 0-13-604259-7.
  2. Introduction to Artificial Intelligence & Expert Systems, Patterson Pearson, 1st ed. 2015, ISBN-10: 9332551944, ISBN-13: 978-8120307773.
  3. Intelligent Planning: A decomposition and abstraction-based approach Yang, Q, Springer Verlag, Berlin Heidelberg, 1997. ISBN-10: 354061901, ISBN-13: 978-3540619017.

Open Elective: Electrical and Hybrid Vehicles [100616]

  • Unit 1.0: Introduction
    • Conventional Vehicles
    • Basics Of Vehicle Performance
    • Vehicle Power Source Characterization
    • Transmission Characteristics
    • Mathematical Models To Describe Vehicle Performance
    • Introduction To Hybrid Electric Vehicles
    • History Of Hybrid And Electric Vehicles
    • Social And Environmental Importance Of Hybrid And Electric Vehicles
    • Impact Of Modern Drive-Trains On Energy Supplies
  • Unit 2.0: Hybrid Electric Drive-trains
    • Hybrid Electric Drive-Trains
    • Basic Concept Of Hybrid Traction
    • Introduction To Various Hybrid Drive-Train Topologies
    • Power Flow Control In Hybrid Drive-Train Topologies
    • Fuel Efficiency Analysis
  • Unit 3.0: Electric Trains
    • Electric Drive-Trains
    • Basic Concept Of Electric Traction
    • Introduction To Various Electric Drive-Train Topologies
    • Power Flow Control In Electric Drive-Train Topologies
    • Fuel Efficiency Analysis
    • Electric Propulsion Unit
    • Introduction To Electric Components Used In Hybrid And Electric Vehicles
    • Configuration And Control Of DC Motor Drives
    • Configuration And Control Of Induction Motor Drives
    • Configuration And Control Of Permanent Magnet Motor Drives
    • Configuration And Control Of Switch Reluctance Motor Drives
    • Drive System Efficiency
  • Unit 4.0: Energy Storage
    • Energy Storage
    • Introduction To Energy Storage Requirements In Hybrid And Electric Vehicles
    • Battery Based Energy Storage And Its Analysis
    • Fuel Cell Based Energy Storage And Its Analysis
    • Super Capacitor Based Energy Storage And Its Analysis
    • Flywheel Based Energy Storage And Its Analysis
    • Hybridization Of Different Energy Storage Devices
  • Unit 5.0: Sizing the drive system
    • Sizing The Drive System
    • Matching The Electric Machine And The Internal Combustion Engine (ICE)
    • Sizing The Propulsion Motor
    • Sizing The Power Electronics
    • Selecting The Energy Storage Technology
    • Communications
    • Supporting Subsystems
  • Unit 6.0: Energy Management Strategies
    • Energy Management Strategies
    • Introduction To Energy Management Strategies Used In Hybrid And Electric Vehicles
    • Classification Of Different Energy Management Strategies
    • Comparison Of Different Energy Management Strategies
    • Implementation Issues Of Energy Management Strategies
    • Case Studies
    • Design Of A Hybrid Electric Vehicle (HEV)
    • Design Of A Battery Electric Vehicle (BEV)

Text/Reference Books:

  1. C. Mi, M. A. Masrur and D. W. Gao, "Hybrid Electric Vehicles: Principles and Applications with Practical Perspectives", John Wiley & Sons, 2011.
  2. S. Onori, L. Serrao and G. Rizzoni, "Hybrid Electric Vehicles: Energy Management Strategies", Springer, 2016.
  3. M. Ehsani, Y. Gao, S. E. Gay and A. Emadi, "Modern Electric, Hybrid Electric, and Fuel Cell Vehicles: Fundamentals, Theory, and Design", CRC Press, 2004.
  4. T. Denton, "Electric and Hybrid Vehicles", Routledge, 2016.

Open Elective: Industrial Automation [100617]

  • Unit 1.0: Introduction to Industrial Automation
    • Introduction To Industry 4.0 And Its Components
    • Need Of Automation In Industries
    • Principles And Strategies Of Automation
    • Factory Automation
    • Process Automation
    • Basic Elements Of An Automated System
    • Structure Of Industrial Automation
    • Advanced Automation Functions
    • Levels Of Automations
    • Industrial Control Systems- Process And Discrete System
    • Types Of Automation System
    • Fixed
    • Programmable
    • Flexible
    • Integrated Automation And Its Application
    • Different Systems Used For Industrial Automation
    • PLC
    • HMI
    • SCADA
    • DCS
    • Drives
    • Introduction To Internet Of Things (IoT) And Industrial Internet Of Things (IIOT) And Its Application In Automation
    • Role Of Robots In Automation And Its Components
    • Fundamentals Of Automated Production Lines Or Transfer Lines And Its Applications
  • Unit 2.0: Sensors and Input Field Devices
    • Analog Input Devices Electromagnetic Relays
    • Contactors
    • Motor Starters
    • Manually Operated Switches Toggle Switch
    • Pushbutton Switch
    • Knife Switch And Selector Switches
    • Mechanically Operated Switches Limit Switch
    • Temperature Switch (Thermostat)
    • Pressure Switch
    • Level Switch And Their Symbols
    • Discrete/Digital Input Devices
    • Construction And Working Of Sensors
    • Proximity Sensors- Inductive
    • Capacitive
    • Optical And Ultrasonic
    • Advanced Sensors- Construction And Working Of Temperature Sensors- Thermistor
    • Thermocouple And Resistance Temperature Detector (RTD)
    • Liquid Level Sensor - Capacitive And Ultrasonic
    • Force - Strain/Weight Sensors
    • Flow Sensors - Turbine Flow Sensor
    • Pressure Sensors- Linear Variable Differential Transformer (LVDT)
    • Inclination Sensor - Inclinometer
    • Acceleration Sensor- Accelerometer
    • Angular And Linear Position Sensor
  • Unit 3.0: Actuators and Output Devices
    • Introduction To Actuators
    • Classification Of Actuators
    • Mechanical Actuators - Translational And Rotational Motion
    • Kinematic Chains
    • Cams
    • Gears
    • Belt And Chain Drives
    • Bearings
    • Hydraulic And Pneumatic Actuators Linear And Rotary Actuators
    • Single And Double Acting Cylinder
    • Directional
    • Process And Pressure Control Valves
    • Electrical Actuators
    • Electromechanical Actuators
    • Construction
    • Working And Application Of Stepper Motors
    • AC/DC Servo Motors
    • BLDC Motor (Very Brief)
    • Electrohydraulic Actuators- Solenoid Valve
    • Thermal Actuators And Magnetic Actuators
    • Selection Of Actuators
  • Unit 4.0: Other output Devices
    • Other Output Devices- Indicators
    • Alarms Pilot Lights
    • Buzzers
    • Valves
    • Motor Starters
    • Horns And Alarms
    • Stack Lights Control Relays
    • Pumps And Fans
  • Unit 5.0: Control System
    • Open And Closed Loop System
    • Their Transfer Function
    • First Order And Second Order System And Their Output Response And Parameters
    • Types Of Control - On-Off
    • Feed Forward
    • Open Loop And Closed Loop Control And Transfer Function
    • Controllers In Closed Loop Control
    • Proportional Controller (P Controller)
    • Integral Controller (I Controller)
    • Derivative Controller (D-Controller)
    • P-I Controller
    • P-D Controller
    • PID Controller
  • Unit 6.0: SCADA & DCS
    • Introduction
    • Need
    • Benefits And Typical Applications Of SCADA And DCS
    • SCADA Architecture - Remote Terminal Units (RTUs)
    • Master Terminal Units
    • Various SCADA Editors
    • Communication Protocols For SCADA
    • Comparison Of SCADA With DCS
    • Interfacing SCADA System With PLC Typical Connection Diagram
    • Object Linking And Embedding For Process Control (OPC) Architecture
    • Creating SCADA Screen HMI For Simple Object
    • Steps For Linking SCADA Object (Defining Tags And Items, Creating Trends Etc.,) With PLC Ladder Program Using OPC
    • Configuring Simple Applications Using SCADA
    • Traffic Light Control
    • Water Distribution
    • Pipeline Control
    • Power Generation
    • Transmission And Distribution Etc.
    • Procedure To Maintain The SCADA Based PLC System

Text/Reference Books:

  1. Industrial Automation with SCADA: Concepts, Communications and Security, K S Manoj Notion Press; 1st edition, 2019, ISBN-13: 978-1684668281.
  2. Introduction to Industrial Automation, Stamatos Manesis, George Nikolakopoulos, CRC Press, 1st edition, 2020, ISBN 9780367571832.
  3. Industrial Automation Using PLC SCADA & DCS, R.G. Jamkar, Global Education Limited, 2018, ISBN-13: 978-8193579954.
  4. Industrial automation and Process control, Stensenon Jon, PHI Learning, New Delhi, 2003, ISBN: 9780130618900.
  5. Control System, Nagrath & Gopal, New Age International Pvt Ltd, ISBN: 9789386070111.
  6. Industrial automation and Process control, Stensenon Jon PHI Learning, New Delhi, 2003, ISBN: 9780130618900.
  7. Programmable Logic Controller, Jadhav, V. R., Khanna publishers, New Delhi, 2017, ISBN: 9788174092281.
  8. Programmable Logic Controllers and Industrial Automation - An introduction, Mitra, Madhuchandra; Sengupta, Samarjit Penram International Publication, 2015, ISBN: 9788187972174.
  9. Supervisory Control and Data Acquisition, Boyar, S. A., ISA Publication, USA, ISBN: 978-1936007097.
  10. Practical SCADA for industry Bailey David; Wright Edwin Newnes (an imprint of Elsevier), UK 2003, ISBN: 0750658053.

Open Elective: Basic of ML [100618]

  • Unit 1.0: Introduction to Machine Learning and Fundamentals
    • Introduction To Machine Learning
    • Supervised Learning
    • Unsupervised Learning And Reinforcement Learning
    • Machine Learning Basics
    • Capacity
    • Over Fitting And Under Fitting
    • Hyperparameters And Validation Sets
    • Bias & Variance
  • Unit 2.0: Bayesian Concepts and Decision Trees
    • Bayes Theorem
    • Concept Learning Maximum Likelihood Classifier
    • Bayesian Belief Networks
    • Decision-Trees
    • Univariate And Multivariate Decision Tree
    • Network Equivalent Of Decision Trees
    • Overfitting And Evaluation
  • Unit 3.0: Instant-Based Learning and Support Vector Machines
    • Logistic Regression
    • Support Vector Machine (SVM)
    • Kernel Function And Kernel SVM
    • Instant-Based Learning
    • K-Nearest Neighbour
    • Locally Weighted Regression
    • Radial Basis Functions
    • Case Based Learning
  • Unit 4.0: Clustering
    • Clustering
    • K-Means
    • Adaptive Hierarchical Clustering
    • Gaussian Mixture Model
  • Unit 5.0: Neural Networks
    • Neural Network
    • Perception
    • Multilayer Network
    • Back Propagation
  • Unit 6.0: Applications and Case Studies of Machine Learning
    • Applications Of Machine Learning (Case Studies)
    • Business Analytics
    • Natural Language Processing
    • Computer Vision
    • Internet Of Things
    • Bio-Informatics Etc.

Text/Reference Books:

  1. Machine Learning, Tom M. Mitchell, McGraw-Hill Education (India) Private Limited, 2013, ISBN 0070428077.
  2. Foundations of Machine Learning, Mohri, M., Rostamizadeh, A., and Talwalkar, A. The MIT Press, 2012, ISBN 78-0-262-01825-8.
  3. Fundamentals of Machine Learning, Dr. M. Gopal, McGraw Hill Education (India), ISBN: 978-9353161837.
  4. Machine Learning: Principles and Algorithms, P. K. Pattanayak, Universities Press (India) ISBN: 978-9386235513.

Open Elective: AR VR Technology [100619]

  • Unit 1.0: Introduction to Immersive Technologies
    • Overview Of Immersive Technologies
    • Augmented Reality (AR)
    • Virtual Reality (VR)
    • Mixed Reality (MR) And Extended Reality (XR)
    • Applications In Education
    • Healthcare
    • Entertainment And Industry
    • Key Differences Between AR, VR, MR And XR
    • Challenges And Future Trends
  • Unit 2.0: Hardware and Software Requirements
    • AR/VR Headsets And Displays (E.g., Oculus, HoloLens, Etc.)
    • Sensors
    • Motion
    • Depth And Tracking Systems
    • Input Devices
    • Controllers
    • Gloves And Mobile Devices
    • System Specifications Of Central Processing Unit (CPU)
    • Graphical Processing Unit (GPU)
    • Random Access Memory (RAM)
    • Graphics Card And Storage Considerations
    • AR/VR Development Platforms (Overview)
    • Unity
    • Unreal Engine
    • SDKs And APIs For AR
    • VR
    • Vuforia
    • ARKit
    • ARCore
  • Unit 3.0: Unity Software
    • Introduction To Unity Software And Its Features
    • System Requirements For Unity Installation
    • Unity's Interface And Basic Functionalities
    • Assets And Its Types
    • Sources Of 2D And 3D Assets
    • Windows In Unity
    • Game Objects And Their Types
    • Rigid Bodies And Colliders
    • Physics-Based Interactions
    • Software Development Kit (SDK)- Vuforia
  • Unit 4.0: Augmented Reality (AR)
    • Principles Of AR And Its Working Mechanisms
    • AR Image And Object Recognition Techniques
    • Location-Based And Marker-Based AR
    • Introduction To Various AR Web-Based Applications
    • AR Design On Blippar Or Similar Platforms
    • Testing And Publishing AR Applications
  • Unit 5.0: AR Design and Development
    • Anchor And Detecting Objects In AR
    • Development Of AR Application Marker-Based And Marker Less In Unity
    • Deployment Of AR App On Android/iOS Devices
  • Unit 6.0: Virtual Reality (VR)
    • Principles And Technical Requirements Of Virtual Reality
    • Types Of VR Systems
    • Non-Immersive
    • Semi-Immersive And Fully Immersive
    • Key Elements Of Immersive VR Experience
    • Levels Of Immersion In VR Environment
    • 360-Degree Media

Text/Reference Books:

  1. Learning Path - Complete VR & AR Development with Unity, Jesse Glover & J. Linowes, Packt Publishers Ltd., ISBN-10: 1838648186, ISBN-13: 978-1838648183.
  2. Mastering AR Development with Unity, Indika Wijesooriya, BPB.
  3. 3D Game Development with Unity, Franz Lanzinger, CRC Press, ISBN-10: 0367349183, ISBN-13: 978-0367349189.
  4. AR with Unity; AR Foundation - A Practical Guide, Jonathan Linowes, Packt Publishers Ltd., ISBN: 978-1-83898-259-1.

Open Elective: Micro Electro Mechanical System (MEMS) Technology [100620]

  • Unit 1.0: Introduction to Mems and Microfabrication
    • History Of MEMS Development
    • Characteristics Of MEMS
    • Miniaturization
    • Microelectronics Integration
    • Mass Fabrication With Precision
    • Micro Fabrication
    • Microelectronics Fabrication Process
    • Silicon Based MEMS Processes
    • New Material And Fabrication Processing
    • Points Of Consideration For Processing
  • Unit 2.0: Electrical and Mechanical Properties of Mems Materials
    • Conductivity Of Semiconductors
    • Crystal Plane And Orientation
    • Stress And Stain
    • Definition
    • Relationship Between Tensile Stress And Stain
    • Mechanical Properties Of Silicon And Thin Films
    • Flexural Beam Bending Analysis Under Single Loading Condition
    • Types Of Beam
    • Deflection Of Beam
    • Longitudinal Stain Under Pure Bending
    • Spring Constant
    • Tensional Deflection
    • Intrinsic Stress
    • Resonance And Quality Factor
  • Unit 3.0: Sensing and Actuation
    • Electrostatic Sensing And Actuation
    • Parallel Plate Capacitor
    • Application- Inertial Sensor
    • Pressure Sensor And Tactile Sensor
    • Parallel Plate Actuator And Comb Drive
    • Thermal Sensing And Actuations
    • Thermal Sensors
    • Thermal Actuators
    • Application- Inertial
    • Flow And Infrared Sensors
    • Piezoresistive Sensors
    • Piezoresistive Sensor Material
    • Stress In Flexural Cantilever And Membrane- Application- Inertial
    • Pressure
    • Flow And Tactile Sensor
    • Piezoelectric Sensing And Actuation
    • Piezoelectric Material Properties- Quartz- PZT- PVDF - ZnO
    • Application- Inertial
    • Acoustic
    • Tactile
    • Flow- Surface Elastic Waves
    • Magnetic Actuation
    • Micro Magnetic Actuation Principle
    • Deposition Of Magnetic Materials
    • Design And Fabrication Of Magnetic Coil
  • Unit 4.0: Bulk and Surface Micromachining
    • Anisotropic Wet Etching
    • Dry Etching Of Silicon
    • Deep Reactive Ion Etching (DRIE)
    • Isotropic Wet Etching
    • Basic Surface Micromachining Process
    • Structural And Sacrificial Material
    • Stiction And Anti Stiction Methods
    • Foundry Process
  • Unit 5.0: Polymer Mems
    • Polymers In MEMS
    • Polymide- SU-8
    • Liquid Crystal Polymer (LCP)
    • PDMS
    • PMMA
    • Parylene
    • Fluorocarbon
    • Application- Acceleration
    • Pressure
    • Flow And Tactile Sensors
  • Unit 6.0: Optical Mems
    • Optical MEMS
    • Refraction
    • Diffraction
    • MOEMS Components
    • Digital Mirror Display (DMD)
    • Grating Light Valve (GLV)
    • Optical Scanners

Text/Reference Books:

  1. Foundations of MEMS, Chang Liu, Pearson International Edition, 2006, ISBN-978-0132497367.
  2. RF MEMS Theory, Design and Technology, Gaberiel M. Rebiz, John Wiley & Sons, 2003, ISBN-978-0471201694.
  3. Introduction to nanotechnology, Charles P. Poole, Frank J. Owens, John Wiley & sons, 2003, ISBN-13: 978-0471079354.
  4. Microsensors, MEMS and Smart devices, Julian W. Gardner, Vijay K Varadhan, John Wiley & sons, 2001, ISBN-978-0471861096.

Open Elective: Electronic Product Design & Packaging [100621]

  • Unit 1.0: Essentials of Electronic Product Design & Packaging
    • Introduction To Electronic Product Design
    • Electronic Packaging Fundamentals
    • Printed Circuit Board (PCB) Design And Fabrication
    • Thermal
    • Mechanical And EMI/EMC Considerations
    • Prototyping
    • Testing And Reliability
  • Unit 2.0: Design Aspects of Semiconductor Packaging
    • Overview Of Semiconductor Packaging Types
    • Dual In-Line Package (DIP)
    • QFP
    • BGA
    • CSP And 3D ICs
    • Wire Bonding
    • Flip-Chip And Through-Silicon Vias (TSVs)
    • Trends In Package Miniaturization And Integration
    • Thermal And Mechanical Design Considerations
    • Heat Dissipation In Semiconductor Packages
    • Stress And Strain Due To Thermal Cycling
    • Package Warpage And Delamination Issues
    • Electrical Design Aspects
    • Signal Integrity And Power Integrity
    • Parasitics
    • Resistance
    • Capacitance And Inductance
    • High-Speed Design Challenges And Mitigation Techniques
    • Materials And Substrate Technologies
    • Die Attach Materials
    • Encapsulants And Underfills
    • Organic Vs Ceramic Substrates
    • Reliability And Compatibility Of Packaging Materials
    • Packaging Process Flow And Testing
    • Wafer-Level Packaging And Assembly Steps
    • Burn-In
    • Electrical And Reliability Testing
    • Design For Testability (DFT) In Semiconductor Packaging
  • Unit 3.0: Dicing & Inspection
    • Wafer Dicing Techniques
    • Mechanical Sawing (Blade Dicing)
    • Laser Dicing And Stealth Dicing
    • Plasma Dicing (Dry Etching Methods)
    • Comparison Of Dicing Methods Based On Precision
    • Cost And Material Type
    • Dicing Process Parameters And Optimization
    • Cut Depth
    • Kerf Width And Feed Rate
    • Cooling And Lubrication During Dicing
    • Minimizing Chipping
    • Cracking And Contamination
    • Wafer Mounting And Handling
    • Use Of Dicing Tapes And Frames
    • Wafer Alignment And Chucking
    • ESD Precautions And Cleanroom Requirements
    • Post-Dicing Cleaning And Debris Removal
    • Cleaning Techniques (Wet, Dry, CO2 Snow)
    • Particle Contamination Control
    • Inspection For Surface Damage Or Residues
    • Wafer Inspection And Defect Analysis
    • Visual And Automated Optical Inspection (AOI)
    • Surface And Edge Defect Detection
    • Use Of SEM
    • X-Ray And Infrared Imaging For Deeper Inspection
    • Yield Analysis And Defect Classification
  • Unit 4.0: Conventional Packaging
    • Introduction To Conventional Packaging Types
    • Dual In-Line Package (DIP)
    • Surface Mount Device (SMD)
    • Chip-On-Board (COB) And Leadframe-Based Packaging
    • Through-Hole Vs. Surface-Mount Technologies
    • Materials Used In Conventional Packaging
    • Encapsulants And Molding Compounds
    • Leadframe Materials (E.g., Copper, Brass, And Alloys)
    • Substrate Materials
    • Epoxy
    • Ceramic And Organic Laminates
    • Packaging Assembly Processes
    • Die Attach Methods
    • Eutectic Bonding
    • Adhesive Bonding
    • Wire Bonding Techniques
    • Gold
    • Aluminum And Copper Wire
    • Molding And Encapsulation Processes
    • Electrical And Thermal Design In Conventional Packaging
    • Signal Integrity In Conventional Packages
    • Heat Dissipation And Thermal Management Strategies
    • Thermal Cycling And Reliability Considerations
    • Testing And Reliability Of Conventional Packages
    • Standard Testing Methods
    • Electrical
    • Thermal And Mechanical Tests
    • Reliability Testing
    • Accelerated Life Testing (ALT)
    • Burn-In Tests
    • Failure Analysis Techniques
    • Decapsulation
    • Cross-Sectioning
  • Unit 5.0: Bonding and Sealing
    • Bonding Techniques In Semiconductor Packaging
    • Wire Bonding (Gold, Aluminum, Copper)
    • Flip-Chip Bonding And Solder Bumping
    • Adhesive Bonding And Thermo-Compression Bonding
    • Laser And Ultrasonic Bonding Methods
    • Sealing Methods In Semiconductor Packaging
    • Molding And Encapsulation Processes
    • Hermetic Sealing And Its Importance For High-Reliability Applications
    • Use Of Sealing Materials
    • Epoxy
    • Silicone And Elastomers
    • Advanced Sealing Techniques For 3D And Wafer-Level Packaging
    • Reliability And Testing In Bonding And Sealing
    • Mechanical And Thermal Stress Testing In Bonded And Sealed Packages
    • Failure Analysis Methods
    • Decapsulation
    • Cross-Sectioning And SEM Analysis
  • Unit 6.0: Advanced Packaging
    • Advanced Packaging Technologies
    • System-In-Package (SiP) And Package-On-Package (PoP) Technologies
    • 3D Integrated Circuits (3D ICs) And Through-Silicon Vias (TSVs)
    • Wafer-Level Packaging (WLP) And Fan-Out Wafer-Level Packaging (FOWLP)
    • Hybrid And Multi-Chip Module (MCM) Integration
    • Thermal And Electrical Considerations In Advanced Packaging
    • Thermal Management Techniques In Advanced Packaging (Heat Sinks, Thermal Vias)
    • Electrical Performance Challenges
    • Signal Integrity And Power Delivery In High-Density Packages
    • Power Dissipation And Interconnect Strategies In 3D Packaging
    • Reliability Testing Standards For Advanced Packaging (E.g., JEDEC, MIL-STD)

Text/Reference Books:

  1. Electronic Packaging and Interconnection Handbook, Charles Harper, ISBN-13: 978-0071430487, McGraw-Hill Professional, Edition: 4, Publication Date: 16 November 2004.
  2. "Electronic Product Design" A.E. Ward and J.A.S. Angus Chapman and Hall, ISBN: 0-412-63200-4, 1996.
  3. Electronic Product Design, S.D. Mehta, S Chand Publishing ISBN: 9788121936156, 2011.
  4. Semiconductor Packaging Material Interaction and reliability, Chen, Andrea & Lo, Randy Hsiao-Yu, ISBN-13: 978-1439862056, CRC Press, 10 October 2011.
  5. Semiconductor Device Packaging, John H. Lau, Springer, ISBN-10: 9811613753, ISBN-13: 978-9811613753.
  6. Microelectronics Packaging Handbook - Part 1, Part 2, Part 3, R. R. Tumalla, Springer US, ISBN-13: 978-0412084416.
  7. Advanced Electronics Packaging, Richard K. Ulrich Wiley-IEEE Press, ISBN-13: 978-0471466093.
  8. Integrated Circuit Packaging, Assembly and Interconnection, William J. Greig, Springer, ISBN-13: 978-0387281537.
  9. 3D IC Integration and Packaging, John H Lau, McGraw-Hill Education, ISBN-13: 978-0071848060.

Open Elective: 3D Printing and Design [100622]

  • Unit 1.0: Additive Manufacturing Introduction and CAD-CAM for 3D Printing
    • Additive V/S Conventional Manufacturing Processes
    • Classification Of 3D Printing Processes
    • Working Principle Of Various 3D Printing Processes- Fused Deposition Modeling (FDM)
    • Stereo Lithography (SLA)
    • Selective Laser Sintering (SLS)
    • Binder Jetting
    • Material Jetting
    • Direct Energy Deposition And Laminate Object Manufacturing
    • Additive Manufacturing Application Domains
    • Aerospace
    • Electronics
    • Health Care
    • Defense
    • Automotive
    • Construction
    • Food Processing
    • Machine Tools
    • Product Design And Prototyping
    • Reverse Engineering For 3D Printing
    • CAD-CAM And Its Integration
    • CAD-Part And Surface Modeling
    • CAD File Formats
    • Process Chain For 3D Printing
    • STL Interface Specification
    • STL Data Generation
    • STL Data Manipulation
    • Advantages And Limitations Of STL File Format
    • Open Files
    • Repair Of STL Files
    • Alternative 3D Printing Interfaces
    • Part Orientation And Support Generation
    • Factors Affecting Part Orientation
    • Various Models For Part Orientation Determination
    • The Function Of Part Supports
    • Support Structure Design
    • Automatic Support Structure Generation
    • Model Slicing And Contour Data Organization
    • Direct And Adaptive Slicing
    • Identification Of Peak Features
    • Adaptive Layer Thickness Determination
    • Tool Path Generation
  • Unit 2.0: 3D Printing Materials
    • Various Forms Of 3D Printing Raw Material- Liquid
    • Solid
    • Wire
    • Powder
    • Popular FDM
    • SLA
    • SLS
    • Binder Jetting
    • Material Jetting And Direct Energy Deposition 3D Printing Materials
    • Polymers
    • Metals
    • Non-Metals
    • Ceramics
    • Polymers And Their Properties
    • Powder Preparation And Their Desired Properties
    • Choosing The Right 3D Printing Material On The Basis Of Performance Requirements And Material Properties
  • Unit 3.0: Solid based 3D Printing Processes
    • Basic Principle And Working Of Fused Deposition Modeling (FDM) Process
    • Construction Details And Working Of Established FDM Based 3D Printers For Plastics Parts
    • 3D Printer Software- Fusion 360
    • Solidworks
    • Onshape
    • Tinkercad
    • UltimakerCura
    • MeshLab
    • Simplyfy 3D
    • Repetier Host
    • Slic3r
    • Etc. - Use And Operation Of Anyone
    • 3D Scanners And Working
    • Producing A Part Using FDM Based 3D Printer
    • Liquefaction
    • Solidification And Bonding
    • Laminated Object Manufacturing Process
    • Cost Estimation Of FDM 3D Printed Component
  • Unit 4.0: Liquid based 3D Printing Processes
    • Photo Polymerization
    • Principle And Working Of Stereo Lithography Apparatus
    • SLA Based 3D Printing Processes
    • SLA Based 3D Printing Process Materials
    • Scanning Techniques
    • Curing Processes
    • Cost Estimation Of SLA 3D Printed Component
  • Unit 5.0: Powder based 3D Printing Processes
    • Powder Fusion Mechanism
    • Principle And Working Of Selective Laser Sintering (SLS) Process
    • SLS Based 3D Printers
    • Laser Engineering Net Shaping Process
    • Electron Beam Melting

Text/Reference Books:

  1. Fundamentals and Applications of Additive Manufacturing, Sharad K. Pradhan, Ankit Nayak, Surendra Singh Thakur, Vishal Francis, Aniket Nagargojc CRC Press, Taylor & Francis, ISBN 9781032898049.
  2. Understanding Additive Manufacturing: Rapid Prototyping, Rapid Tooling, Rapid Manufacturing Andreas Gebhardt, Hanser Publisher, 2011, ISBN: 156990507X, 9781569905074.
  3. 3D Printing and Design, Sabrie Soloman, Khanna Publishing House, Delhi, ISBN: 9789386173768.
  4. 3D Printing and Rapid Prototyping- Principles and Applications, C.K. Chua, Kah Fai Leong World Scientific, 2017, ISBN: 9789813146754.
  5. Getting Started with 3D Printing: A Hands-on Guide to the Hardware, Software, and Services Behind the New Manufacturing Revolution, Liza Wallach Kloski, Nick Kloski Make Community, LLC; 2nd edition, 2021, ISBN: 9781680450200.

Robotic Programming and Software Development Lab [117601P]

Perform all experiments from the following list:

  • Programming Using Teach Pendant Method
  • Interfacing ROS And Arduino/Others
  • Programming Mobile Robot Navigation Using C++ Or Python
  • Sensor Interfacing Using ROS
  • Programming On VAL Language
  • Programming On RAPID Language
  • Programming On AML Language
  • Programming The Robot For Pick And Place Operation Using Any Robot
  • Robot Programming For Colour Identification/Shape Identification/Path Tracking
  • Simulating A Custom Robot With Teleoperation Using Open Source Software

Signal Conditioning and Data Acquisition System Lab [117603P]

List of Experiments:

  • Design And Implementation Of An 8-Bit ADC Using PIC/Other Microcontroller
  • Design And Implementation Of An 8-Bit DAC Using PIC/Other Microcontroller
  • Working Of A Low-Pass, High Pass And Bass Filters Using PIC/ Or Any Other IC
  • Working Of A 555 Timer Circuit With Any Specific Application
  • Working Of A 555 Circuit With Any Counter Application
  • Simulation/Design Of The Sample And Hold Circuit With Standard Simulation Tools
  • Design And Simulation Of SPI Protocol Using PIC/Any Other Microcontroller
  • Design And Simulation Of I2C Protocol Using PIC/Any Other Microcontroller
  • Design Of A Standard Data Logging System Using PIC/Any Other Microcontroller Using Any Sensor
  • Simulation Of Data Analysis Techniques With Standard Tools/Software

NPTEL Courses-I Lab [117605P]

Details for NPTEL Courses-I Lab will be provided by the department.

← BEU PYQ Home